Design Driven Dummy Filling

Brault, Frederic; Chaisemartin, Philippe Morey

doi:10.1145/3459104.3459175

Cited by 1 publication

(1 citation statement)

References 7 publications

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“…In this case, the generation of crack-stop patterns could be performed at the same time as the dummies insertion. The flow described by Brault et al, 12 uses a customizable grid-based dummies instantiation method.…”

Section: Advanced Crack-stop Integrationmentioning

confidence: 99%

Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns

Bravo¹,

Morey-Chaisemartin²,

Chang³

et al. 2023

DTCO and Computational Patterning II

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The demand for high-performance semiconductor products has increased with no end in sight since the early days of this industry. This product demand phenomenon has continuously pushed the technological frontier to a moving limit for enhanced performance leading to the need for an ever-thinner die for advanced 3D packaging. Die down to a thickness of 5 µm is feasible. The thin die approach may lead to a heterogenous stack of 50 dies, leading to the highest available performance with an unprecedented form factor. One significant barrier is the fragility of the thin die and its impact on yield, reliability, and costs. A comprehensive crack propagation and thin die fragility model that is rich in both theory and application is presented. In this paper, we show an MPW reticle placement with automation that inserts new and specific crack-stop patterns to mitigate the risk of die wafer fracture. We show this method to address die fracture from both the front and the back sides of the wafer, yielding an authentic 3D approach to crack-stop.

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Section: Advanced Crack-stop Integrationmentioning

confidence: 99%