2016
DOI: 10.1109/tia.2016.2587098
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Design Considerations and Performance Evaluation of 1200-V 100-A SiC MOSFET-Based Two-Level Voltage Source Converter

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Cited by 86 publications
(34 citation statements)
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“…To ensure the accuracy of the loss simulation model, it is necessary to test some key parameters of the devices [25][26][27][28].…”
Section: The Characteristics Of the 1700 V/225 A Sic Mosfetmentioning
confidence: 99%
“…To ensure the accuracy of the loss simulation model, it is necessary to test some key parameters of the devices [25][26][27][28].…”
Section: The Characteristics Of the 1700 V/225 A Sic Mosfetmentioning
confidence: 99%
“…In contrast, the SiC module which is a unipolar device generating no tail current, and its freewheel diode which is SiC-SBD yielding the inverse recovery current at low-level hardly varies against the temperature. Furthermore, the switching loss is slightly reduced due to drop of the threshold voltage at higher temperature [4,9,10]. The result this time revealed that the full SiC module loss remained almost unchanged relative to the temperature when compared with that of the Si-IGBT module.…”
Section: Switching Evaluation Using High-speed Drive Circuitmentioning
confidence: 99%
“…SiC devices improve 2-level converter efficiency even whilst operating with increased switching frequency, thus also reducing filter bulk, loss and cost [7][8][9][10], compared with traditional IGBT 2-level converters. However, increased efficiency brought by SiC comes with the risk of increased EMI caused by the rapid switching transients, combined with the greater EMI generated as switching frequency is increased in order to reduce filter loss and bulk.…”
Section: Introductionmentioning
confidence: 99%
“…Both the SiC 2-level converter and the Si MOSFET MMC are suited to the bidirectional operation necessary to support low carbon electrical supply using energy storage in the form of Vehicle-to-Grid (V2G) energy transfer. Furthermore, it is noted that SiC MOSFET gate drive must be bipolar in order to achieve optimum performance [7][8][9][10]15], with careful design to prevent over-or under-voltage on the gate [15] and to reduce parasitic-induced oscillations [9]. Destruction as a result of unwanted device turn-on is of far greater risk in SiC MOSFETs compared with Si MOSFETs [15,16], while gate oxide reliability has been a challenge to SiC [17,18] with some improvement in gate oxide tolerance to temperature more recently [7].…”
Section: Introductionmentioning
confidence: 99%