2016
DOI: 10.1016/j.enconman.2015.11.068
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Design, assembly and characterization of silicide-based thermoelectric modules

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Cited by 66 publications
(63 citation statements)
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References 32 publications
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“…For example, n-type Mg 2 Si 0.3 Ge 0.05 Sn 0.65 boasts a zT at ~750 K of 1.4 while p-type Mg 2 Ge 0.4 Sn 0.6 only reaches a maximum zT of 0.5 at around the same temperature. Despite the low efficiency of p-type Mg-based thermoelectric materials, some preliminary results on device design and construction of devices based on these materials has already been achieved 15,16,58,[121][122][123][124] . The low performance of the ptype Mg-based thermoelectric materials creates serious limitations on the construction of devices, and most reports on the use of these materials in modules are on n-type legs 15,58,121 .…”
Section: Applications and Devicesmentioning
confidence: 99%
See 1 more Smart Citation
“…For example, n-type Mg 2 Si 0.3 Ge 0.05 Sn 0.65 boasts a zT at ~750 K of 1.4 while p-type Mg 2 Ge 0.4 Sn 0.6 only reaches a maximum zT of 0.5 at around the same temperature. Despite the low efficiency of p-type Mg-based thermoelectric materials, some preliminary results on device design and construction of devices based on these materials has already been achieved 15,16,58,[121][122][123][124] . The low performance of the ptype Mg-based thermoelectric materials creates serious limitations on the construction of devices, and most reports on the use of these materials in modules are on n-type legs 15,58,121 .…”
Section: Applications and Devicesmentioning
confidence: 99%
“…In this study, the authors performed a more in-depth analysis of the Ni/Mg 2 Si interfaces and reported the formation of Ni-Si phases (Figure 10), obtaining a contact resistance of 1. 44 122 . At this point in the development of magnesium-based thermoelectric devices, research efforts are still focused on the development and optimization of bonding techniques and materials, although the long-term stability and impact of the materials used for the junctions on the thermoelectric and mechanical properties of the device are critical to the technology and are yet to be explored.…”
Section: Electrode Bonding Materialsmentioning
confidence: 99%
“…This prevent the direct measure of the conversion efficiency, defined as the ratio of the electrical power supplied to the load and the heat input at the cold side of the device. The heat flux is sometimes obtained by numerical evaluation from material properties [8]. Recently some reports compared different approaches to intermediate temperature TEM test [9], but normally the test system descriptions report few construction details.…”
Section: Introductionmentioning
confidence: 99%
“…Для успешной разработки термоэлектрического модуля необходимо подобрать материал с противоположным типом проводимости, который помимо высокой эффек-тивности должен хорошо согласовываться с материалом ветви n-типа, в противном случае конструкция моду-ля усложняется гибкими тепловыми и электрическими контактами для компенсации различных коэффициентов теплового расширения [4]. Использование термоэлек-трического материала, различающегося только типом проводимости, значительно упрощает конструкцию тер-моэлектрического модуля и повышает его надежность.…”
Section: Introductionunclassified