2016
DOI: 10.1115/1.4033011
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Design and Validation of a High-Temperature Thermal Interface Resistance Measurement System

Abstract: In order to measure thermal interface resistance (TIR) at temperatures up to 700 °C, a test apparatus based on two copper 1D reference bars has been developed. Design details are presented with an emphasis on how the system minimizes the adverse effects of heat losses by convection and radiation on measurement accuracy. Profilometer measurements of the contacting surface are presented to characterize surface roughness and flatness. A Monte Carlo method is applied to quantify experimental uncertainties, resulti… Show more

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Cited by 10 publications
(6 citation statements)
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“…In contact resistance measurement with the 'steady state method,' uncertainty calculation must be taken into account due to the large number of measures that are made. The uncertainty calculation method used is the same as other authors in the literature [35][36][37][38] when applying the same method to measure thermal contact resistances. Table 3 shows the uncertainty values of the equipment.…”
Section: Methodsmentioning
confidence: 99%
“…In contact resistance measurement with the 'steady state method,' uncertainty calculation must be taken into account due to the large number of measures that are made. The uncertainty calculation method used is the same as other authors in the literature [35][36][37][38] when applying the same method to measure thermal contact resistances. Table 3 shows the uncertainty values of the equipment.…”
Section: Methodsmentioning
confidence: 99%
“…As described in more detail in Ref. [29], in order to make the 1D bar steady-state For the thermomechanically matched interface, a CNT array was synthesized on one side of an oxygen-free high thermal conductivity (OFHC) Cu substrate (10mm×10mm×2mm, polished with 1500 grit sanding sheet) as already mentioned. First, a five-layer catalyst (10nm Ti, 100nm Ni, 30nm Ti, 10nm Al, 5nm Fe, from bottom to top) was deposited via thermal evaporation.…”
Section: Methodsmentioning
confidence: 99%
“…Here, utilizing a newly developed test rig and its companion data evaluation designed for conducting high-temperature experiments, we measure and report the thermal properties of vertically oriented multi-walled CNT arrays as thermal interface materials at temperatures up to 700˚C [29]. Both thermomechanically matched and mismatched cases are tested and discussed.…”
Section: Introductionmentioning
confidence: 99%
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“…To experimentally validate our thermal model we designed a test rig modified from the popular ASTM-5470 "reference bar" standard [35,36], as shown in Fig. 3(a,c).…”
Section: Proof-of-concept Test In Vacuummentioning
confidence: 99%