Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application

A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer

“…To ensure the low junction-to-ambient thermal resistance, Hoang et al [16] designed a 3-D-printed cold plate on the top of the device (a copper block with a top surface area of 1 ′′ × 1 ′′ to mimic a computer chip) and characterized it with water as the coolant. They managed to print a strong metal fin structure which can handle the high pressure of the fluid at high flow rates.…”