Design and Synthesis of Functional Silane-Based Silicone Resin and Application in Low-Temperature Curing Silver Conductive Inks

Abstract

In the field of flexible electronics manufacturing, inkjet printing technology is a research hotspot, and it is key to developing low-temperature curing conductive inks that meet printing requirements and have suitable functions. Herein, methylphenylamino silicon oil (N75) and epoxy-modified silicon oil (SE35) were successfully synthesized through functional silicon monomers, and they were used to prepare silicone resin 1030H with nano SiO2. 1030H silicone resin was used as the resin binder for silver conductive ink. The silver conductive ink we prepared with 1030H has good dispersion performance with a particle size of 50–100 nm, as well as good storage stability and excellent adhesion. Additionally, the printing performance and conductivity of the silver conductive ink prepared with n,n-dimethylformamide (DMF): proprylene glycol monomethyl ether (PM) (1:1) as solvent are better than those of the silver conductive ink prepared by DMF and PM solvent. Cured at a low temperature of 160 °C, the resistivity of 1030H-Ag-82%-3 conductive ink is 6.87 × 10−6 Ω·m, and that of 1030H-Ag-92%-3 conductive ink is 0.564 × 10−6 Ω·m, so the low-temperature curing silver conductive ink has high conductivity. The low-temperature curing silver conductive ink we prepared meets the printing requirements and has potential for practical applications.

Robust superhydrophobic silicone/epoxy functional coating with excellent chemical stability and self-cleaning ability

“…The compatibility of superhydrophobic materials is an important factor of material properties, which will directly affect the application value and stability of materials. 40,41 Fig. S3 of the ESI † illustrates the visual changes of AFSR and EP before and after cross-linking and curing reactions, indicating that the sample has undergone a transformation from a homogeneous mixture before the reaction to a cross-linked and cured polymer during the reaction.…”

“…On the contrary, chemical copolymerization modification can overcome such defects well. 41 Due to the modularity, stereospecificity, simplicity, and efficiency, the amine-epoxy "click" chemical reaction 42,43 has become a universal and powerful tool for the modification and functionalization of polymers. 43,44 By introducing flexible polysiloxane chain segments with large bond energy into the epoxy resin system, an interwoven network structure can be formed between the two materials, thus significantly improving the compatibility and reducing the size of the two phases.…”

Phenol–Furfural Resin/Graphite/Ag-Based Electrically Conductive Adhesive Composites from Waste Bagasse with Enhanced Thermo-Electric Properties

“…and 10 1 Scm −1 as the electrical conductivity for epoxy/single-walled nanotubes of carbon-based ECAs. Tang et al [ 26 ] designed and synthesized silicone resin with functional silane and applied this as silver conducting ink, where Ag-silicone resin with 53.93 wt.% Ag showed the lowest resistivity of 1.43 × 10 −6 Ωm and was then applied as the conductive silver ink. Qian et al presented ECAs with higher conductivity and a lower content of conducting filler through utilizing micro- and nano-scale fillers’ synergistic effects.…”