2021
DOI: 10.1016/j.yofte.2020.102429
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Design and simulation of a novel fungus-shaped center embossed diaphragm for fiber optic pressure sensors

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Cited by 5 publications
(1 citation statement)
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References 28 publications
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“…According to different structure and principle, existing high temperature pressure sensors are mainly divided into SOI sensors [1,2], SOS sensors [3], SiC sensors [4,5] and fiber optic sensors [6,7]. SOI sensors are difficult to work for a long time in an environment above 500 ℃, due to factors such as high-temperature creep and high-temperature leakage current increase of silicon.…”
Section: Introductionmentioning
confidence: 99%
“…According to different structure and principle, existing high temperature pressure sensors are mainly divided into SOI sensors [1,2], SOS sensors [3], SiC sensors [4,5] and fiber optic sensors [6,7]. SOI sensors are difficult to work for a long time in an environment above 500 ℃, due to factors such as high-temperature creep and high-temperature leakage current increase of silicon.…”
Section: Introductionmentioning
confidence: 99%