Abstract:-Health and usage monitoring as a technique for online test, diagnosis or prognosis of structures and systems has evolved as a key technology for future critical systems. The technology, often refereed to as HUMS is usually based around sensors that must be more reliable than the system or structure they are monitoring. This paper proposes a fault tolerant sensor architecture and demonstrates the feasibility of realising this architecture through the design of a dual mode humidity/pressure MEMS sensor with an … Show more
“…The experimentally measured diffusion coefficient of 0.9 × 10 Figure 7. This variation has already been reported for moisture desorption in polyimides that suffered the use of SF 6 during O 2 plasma etching [17], as is the case for our dielectric layer during the silicon underetching step [10]. The measured diffusion coefficient is significantly greater than the measured absorption coefficient.…”
Section: Humidity Sensorsupporting
confidence: 71%
“…The fabrication of multiple MEMS sensors on a single substrate could also result in the implementation of sensor redundancy, thereby enabling higher levels of integration and reliability. In the context of Health and Usage Monitoring Microsystems (HUMMs) in particular, MEMS sensors present numerous advantages [6]. For all these reasons, MEMS-based sensor technology is a fast growing area with a promising future in a wide range of applications [7], as it presents many advantages such as the ability to correct cross-sensitivities and the possibility of deployment of the resulting chip in a larger modular system where sensed data can either be logged or immediately read.…”
Section: (A) (B)mentioning
confidence: 99%
“…When compared to the majority of other current modules, this solution offers greater simplicity of operation, lower costs of production and utilization as well as data collection from a greater number of sensors: existing solutions generally consist of fewer sensing capabilities [6] or are comprised of a number of larger discrete sensors [9].…”
Recent progress in data processing, communications and electronics miniaturization is now enabling the development of low-cost wireless sensor networks (WSN), which consist of spatially distributed autonomous sensor modules that collaborate to monitor real-time environmental conditions unobtrusively and with appropriate levels of spatial and temporal granularity. Recent and future applications of this technology range from preventative maintenance and quality control to environmental modelling and failure analysis. In order to fabricate these low-cost, low-power reliable monitoring platforms, it is necessary to improve the level of sensor integration available today. This paper outlines the microfabrication and characterization results of a multifunctional multisensor unit. An existing fabrication process for Complementary Metal Oxide Semiconductor CMOS-compatible microelectromechanical systems (MEMS) structures has been modified and extended to manufacture temperature, relative humidity, corrosion, gas thermal conductivity, and gas flow velocity sensors on a single silicon substrate. A dedicated signal conditioning circuit layer has been built around this MEMS multisensor die for integration on an existing low-power WSN module. The final unit enables accurate readings and cross-sensitivity compensation thanks to a combination of simultaneous readings from multiple sensors. Real-time communication to the outside world is ensured via
OPEN ACCESSMicromachines 2011, 2 411 radio-frequency protocols, and data collection in a serial memory is also made possible for diagnostics applications.
“…The experimentally measured diffusion coefficient of 0.9 × 10 Figure 7. This variation has already been reported for moisture desorption in polyimides that suffered the use of SF 6 during O 2 plasma etching [17], as is the case for our dielectric layer during the silicon underetching step [10]. The measured diffusion coefficient is significantly greater than the measured absorption coefficient.…”
Section: Humidity Sensorsupporting
confidence: 71%
“…The fabrication of multiple MEMS sensors on a single substrate could also result in the implementation of sensor redundancy, thereby enabling higher levels of integration and reliability. In the context of Health and Usage Monitoring Microsystems (HUMMs) in particular, MEMS sensors present numerous advantages [6]. For all these reasons, MEMS-based sensor technology is a fast growing area with a promising future in a wide range of applications [7], as it presents many advantages such as the ability to correct cross-sensitivities and the possibility of deployment of the resulting chip in a larger modular system where sensed data can either be logged or immediately read.…”
Section: (A) (B)mentioning
confidence: 99%
“…When compared to the majority of other current modules, this solution offers greater simplicity of operation, lower costs of production and utilization as well as data collection from a greater number of sensors: existing solutions generally consist of fewer sensing capabilities [6] or are comprised of a number of larger discrete sensors [9].…”
Recent progress in data processing, communications and electronics miniaturization is now enabling the development of low-cost wireless sensor networks (WSN), which consist of spatially distributed autonomous sensor modules that collaborate to monitor real-time environmental conditions unobtrusively and with appropriate levels of spatial and temporal granularity. Recent and future applications of this technology range from preventative maintenance and quality control to environmental modelling and failure analysis. In order to fabricate these low-cost, low-power reliable monitoring platforms, it is necessary to improve the level of sensor integration available today. This paper outlines the microfabrication and characterization results of a multifunctional multisensor unit. An existing fabrication process for Complementary Metal Oxide Semiconductor CMOS-compatible microelectromechanical systems (MEMS) structures has been modified and extended to manufacture temperature, relative humidity, corrosion, gas thermal conductivity, and gas flow velocity sensors on a single silicon substrate. A dedicated signal conditioning circuit layer has been built around this MEMS multisensor die for integration on an existing low-power WSN module. The final unit enables accurate readings and cross-sensitivity compensation thanks to a combination of simultaneous readings from multiple sensors. Real-time communication to the outside world is ensured via
OPEN ACCESSMicromachines 2011, 2 411 radio-frequency protocols, and data collection in a serial memory is also made possible for diagnostics applications.
“…Other Smart Houses also use Health and Usage Monitoring Systems (HUMS). HUMS refers to "sensors that monitor use and condition of a utility, and sub-systems that contain sensors, processors and algorithms" [49].…”
Smart Houses are a prominent field of research referring to environments adapted to assist people in their everyday life. Older people and people with disabilities would benefit the most from the use of Smart Houses because they provide the opportunity for them to stay in their home for as long as possible. In this review, the developments achieved in the field of Smart Houses for the last 16 years are described. The concept of Smart Houses, the most used analysis methods, and current challenges in Smart Houses are presented. A brief introduction of the analysis methods is given, and their implementation is also reported.
“…A few integrated sensors with multifunction to lessen costs and save space have been proposed (Mohammadi Abdolreza et al 2011;Xu et al 2010;Sun and Shida 2000;Fujita and Maenaka 2002). These sensors have been used in many fields from chemical analysis to industry analysis and inspection.…”
This paper describes the design and characterization of an integrated sensor fabricated on the silicon on insulator wafer by micro electro mechanical systems technology. The integrated sensor is comprised of a tri-axis accelerometer, an absolute pressure sensor and a spreadingresistance temperature (SRT) sensor. The optimal size of the sensor structure, natural frequency and cross interference of these three sensors were simulated and determined by finite element analysis. The accelerometer with the cross structure has high sensitivity, good linearity and high response frequency proved by the static and dynamic experiments. The zero-drift, thermal zero-drift and thermal sensitivity of the accelerometer and absolute pressure sensor were also tested. The arrangement of SRT sensor with the wave structure was designed in detail. The optimal location of the SRT sensor was at the edge of chip to avoid stress interference. The integrated sensor with low cost, low mutual interference, smaller volume and good performance can be applied in mobile device, small military plane without driver and some other situations for environmental monitoring.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.