Design and properties of Sn-Bi-In low-temperature solders

Li, Qin; Liu, Yongping; Lin, Jian; Yang, Shi Qing

doi:10.1109/icept.2015.7236635

Cited by 6 publications

(7 citation statements)

References 5 publications

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“…Even though they show excellent solderability and high joint strength, the melting temperature of 245 • C is too high to apply for flexible organic substrate. Thus, research for new interconnection materials has been focused not only on improving electrical and mechanical properties but also on lowering a melting temperature of solder alloys [4][5][6][7][8][9][10][11][12][13][14][15]. Several candidates for new solder materials have shown low melting temperatures as summarized in table 1 [4][5][6][7][8][9][10][11][12][13][14][15].…”

Section: Introductionmentioning

confidence: 99%

“…Thus, research for new interconnection materials has been focused not only on improving electrical and mechanical properties but also on lowering a melting temperature of solder alloys [4][5][6][7][8][9][10][11][12][13][14][15]. Several candidates for new solder materials have shown low melting temperatures as summarized in table 1 [4][5][6][7][8][9][10][11][12][13][14][15]. Sn-Zn alloys have revealed mechanical properties as good as SAC alloys, but the usable organic substrates are still limited due to their relatively high melting temperature of 199 • C [4,5].…”

Section: Introductionmentioning

confidence: 99%

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Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles

Son¹,

Kim²,

Maeng³

et al. 2021

Flex. Print. Electron.

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This study aimed to enhance the mechanical strength of In-48Sn alloy solder bumps without the loss of electrical conductance for application of flexible electronic devices. As a simple method for controlling the mechanical strength, Cu nanoparticles were added to the In-48Sn solder paste during paste formulation. The addition of Ag-encapsulated Cu nanoparticles effectively improved the shear strength without loss of electrical conductance while the addition of Cu nanoparticles deteriorated both mechanical and electrical properties. The development of a dense or coarse microstructure during the soldering process was sensitively dependent on the surface condition and the content of nanoparticles. In particular, the uniform distribution of nanoparticles and alloy phases in β-In 3 Sn phase was critical for the control of mechanical strength of excessively ductile In-48Sn solder. As a result, the addition of 6 wt% Ag-encapsulated Cu nanoparticles improved the shear strength from 18.7 to 49.5 MPa and their electrical resistance from 0.23 to 0.1 mΩ. Flexible LED signage interconnected using these solder bumps performed very well after 100 000 cycles of bending test.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles

Son¹,

Kim²,

Maeng³

et al. 2021

Flex. Print. Electron.

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“…Common low temperature solders consist of tin (Sn) with varying compositions of bismuth (Bi) or indium (In). Bi soldering alloys tend to have higher strength but reduced ductility and susceptibility to thermal aging [52][53][54][55][56][57][58]. On the other hand, In is a much softer alloy, which reduces its strength, yet it has greater ductility.…”

Section: Introductionmentioning

confidence: 99%

“…On the other hand, In is a much softer alloy, which reduces its strength, yet it has greater ductility. Alloys of In are also not as susceptible to thermal aging but it is significantly more expensive than Bi [53,57,59]. A small addition of silver (Ag) with typical weight composition less than 1% in Bi and In solder alloys can improve the reduced properties in both alloys [52,55,57,58,60].…”

Section: Introductionmentioning

confidence: 99%

Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

Neff

Elston

Schrand

2020

Designs

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The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one critical challenge lies in producing robust and reliable interconnections between conductive inks and traditional hardware, especially when subjected to harsh environments. This research examines select material pairings for the most resilient interconnection. The method of test is wire bond pull testing that would represent a continuous strain on a connection and high acceleration testing of up to 50,000 g that would represent a sudden shock that electronics may experience in a drop or crash. Although these two environments may be similar to an overall energy exerted on the connection, the rate of force exerted may lead to different solutions. The results of this research provide insight into material selection for printed electronic interconnections and a framework for interconnection resiliency assessment, which is a critical aspect in realizing the production of next generation electronics technologies for the most demanding environments.

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“…Chen et al [6] investigated the SnAgCu-RE alloy manufactured by multiple steps of melting and using one of the rarest elements. Li et al developed Sn-Bi-In alloys by multiple re-melting steps [7] as it has been difficult to obtain homogeneous mixture required for good quality solders. Hindler et al [8] investigated the thermodynamics of Au-based alloys, including Au-Sb-Sn and Au-Sb, by using conventional quenching in iced water, a time-consuming process.…”

Section: Introductionmentioning

confidence: 99%

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

et al. 2018

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Alloys with the composition of Sn (46.5 at.%)-In (50.7 at.%)-Zn (2.8 at.%) were fabricated by using the ultrarapid quenching process, with quenching rate up to 10 5 K/s. These materials were obtained in the shape of foils with a thickness varying from 30 to 70 lm. Their phase composition, microstructure, grain structure, and texture have been analyzed and revealed that these alloys consist of solid solutions based on the b phase (In 3 Sn) and c phase (InSn 4) with inclusions of zinc. Aging processes in the foils revealed that the volume fraction of zinc (V Zn) increases with the increase in the samples exposure time to the air at room temperature. The electron backscatter diffraction analysis has shown that these foils have a microcrystalline structure. The mechanism of the texture formation in these materials has been explained.

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Design and properties of Sn-Bi-In low-temperature solders

Cited by 6 publications

References 5 publications

Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles

Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles

Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

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