Stretchable electronics typically integrate hard, functional materials on soft substrates. Here we report on engineered elastomeric substrates designed to host stretchable circuitry. Regions of a stiff material, patterned using photolithography, are embedded within a soft elastomer leaving a smooth surface. We present the associated design rules to produce stretchable circuits based on experimental as well as modeling data. We demonstrate our approach with thin-film electronic materials. The "customized" elastomeric substrates may also be used as a generic elastic substrate for stretchable circuits prepared with alternative technologies, such as transfer-printing of inorganic, thinned devices. Stretchable electronics, i.e., integrated circuitry that can reversibly expand and relax, are hybrid systems, combining mechanically disparate, soft and hard, materials within a single structure.1 In most cases, the carrier substrate is an elastic or viscoelastic polymer, e.g., silicones or polyurethanes, characterized by low elastic modulus (E < 10 MPa), large ductility (elongation at break >100%), Poisson's ratio close to 0.5, and thickness in the 10 lm to 1 mm range. By contrast, electronic device materials, used either in thin-film or thinned forms, are stiff (elastic modulus in the GPa range), brittle (fracture strain <5%), and thin (thickness <1 lm). The most common design of stretchable circuitry is to produce a pixelated 2-5 or meshed 6-8 macroscopic structure. The "pixels" or nodes are made of hard materials. A soft elastomeric substrate supports the mechanically rigid nodes and isolates them from the applied macroscopic strain. Figure 1(a) shows a cross-sectional view of the structure: non-deformable platforms hosting fragile electronic materials are distributed on top of the rubbery substrate and are interconnected with elastic wiring.2,9 An elastic encapsulation (not shown in the drawing) can also be added.
10Several advanced stretchable circuits, prepared using this design, have recently been demonstrated and applied to largearea electronics, 6 biomedical wearable interfaces 10 and implantable circuitry.11 These circuits are fabricated with complex, multi-step, multi-carrier processing. Active device materials are first deposited and patterned on a rigid or plastic substrate, which in turn is machined into a thin mesh defining the rigid nodes, and subsequently transferred onto the elastic matrix. Complex wiring technology, based on thick composite elastomers, 7 2D, 8 or 3D 10 meandering structures, is required to interconnect electromechanically the stiff nodes. Despite the latest demonstrations of stretchable circuits, this hard-onsoft, pixelated design suffers from large strain concentration at the rigid-to-elastic transition zones, which often limits the long-term performance of the stretchable circuit. 8 Here we introduce an alternative approach where the pixelated circuits are manufactured directly onto a planar but mechanically engineered heterogeneous elastic substrate. We further present the associated...