2017 North American Power Symposium (NAPS) 2017
DOI: 10.1109/naps.2017.8107322
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Design and performance evaluation of a DC-DC buck-boost converter with cascode GaN FET, SiC JFET, and Si IGBT power devices

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Cited by 8 publications
(4 citation statements)
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“…This topology increases the power density while also integrating gate controller, which allows extremely high switching speeds to be achieved by reduction of parasitic capacitances and inductances (Amano et al 2018). They outperform other high voltage transistor topologies due to significantly lower drain-source resistance (Alharbi et al 2017;Roig et al 2017;Shah et al 2018). However, the maximum drain-source voltage of GaN FET transistors is up to 600 V, and the series connection of the transistors for high voltage stress distribution is complicated by the low internal capacity of these transistors (Roig et al 2017).…”
Section: Overview Of the Principle And Problems Of Pockels Cellsmentioning
confidence: 99%
“…This topology increases the power density while also integrating gate controller, which allows extremely high switching speeds to be achieved by reduction of parasitic capacitances and inductances (Amano et al 2018). They outperform other high voltage transistor topologies due to significantly lower drain-source resistance (Alharbi et al 2017;Roig et al 2017;Shah et al 2018). However, the maximum drain-source voltage of GaN FET transistors is up to 600 V, and the series connection of the transistors for high voltage stress distribution is complicated by the low internal capacity of these transistors (Roig et al 2017).…”
Section: Overview Of the Principle And Problems Of Pockels Cellsmentioning
confidence: 99%
“…Parameter values are taken from Formisano et al (2021), Anthon et al (2015); and Subhashree et al (2019) for L boost and C boost ; from Wei et al (2019), Subhashree et al (2019); Touss et al (2020); and Wang et al (2019) for L buck and C buck ; from Dimitrov et al (2020) and Mohammeda et al (2019) for L buck–boost and C buck–boost , with IGBT technology; and finally from Alharbi (2017); López del Moral et al (2018); and Raj et al (2020) for L buck–boost and C buck–boost with SiC-MOSFET technology.…”
Section: Modellingmentioning
confidence: 99%
“…Academic and industrial researchers have devoted significant efforts and numerous resources to develop and fabricate alternative semiconductor materials with improved characteristics for next-generation power devices due to the limitations of Si devices and an acute global demand for power devices with higher operating capabilities [22], [23]. Emerging wide bandgap (WBG) semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC), exhibit superior material properties than traditional Si materials, enabling power devices to operate effectively under harsh operating conditions [24]- [26]. WGB materials offer outstanding physical properties like a wider energy gap, better thermal conductivity, higher electron mobility, higher saturated velocity, and larger critical electric field [27]- [30].…”
Section: Introductionmentioning
confidence: 99%