2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT) 2020
DOI: 10.1109/icmmt49418.2020.9386943
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Design and Implementation of a Compact Dual-band RF System-in-Package Module

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“…This paper provides a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end for radar application [34,35]. The SIP integrates a variety of chips with different functions, including four bidirectional amplifier chips (BA1), one bidirectional amplifier chip (BA2), one amplitude and phase control multi-function chip (APCMF), one receiver power modulation chip (RPM), and one transmitter power modulation chip (TPM) [36].…”
Section: Methodsmentioning
confidence: 99%
“…This paper provides a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end for radar application [34,35]. The SIP integrates a variety of chips with different functions, including four bidirectional amplifier chips (BA1), one bidirectional amplifier chip (BA2), one amplitude and phase control multi-function chip (APCMF), one receiver power modulation chip (RPM), and one transmitter power modulation chip (TPM) [36].…”
Section: Methodsmentioning
confidence: 99%