2002
DOI: 10.1109/tadvp.2002.807605
|View full text |Cite
|
Sign up to set email alerts
|

Design and fabrication of thin film resistive heaters for hybrid optoelectronic packaging

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2004
2004
2021
2021

Publication Types

Select...
5
2

Relationship

1
6

Authors

Journals

citations
Cited by 7 publications
(3 citation statements)
references
References 12 publications
0
3
0
Order By: Relevance
“…However, if the amount of solder is kept low to begin with, the fiber shift is assumed to be low as well. Ideally, the thickness of the solder on top of the heater should be within [4][5] , so that it can be evaporated with precise thickness control. In our experiments, however, we used 12.5 thick AuSn preform, because we needed greater tolerance in the vertical (transverse) direction to compensate the thickness tolerances of laser submount , fiber ferrule (distance from the axis of the fiber hole to the flat base is ), the fused quartz substrate of the heater , and the solder layers underneath the quartz substrate and the laser submount.…”
Section: Characterization Of Fiber-shift and "Precompensation" Tementioning
confidence: 99%
See 1 more Smart Citation
“…However, if the amount of solder is kept low to begin with, the fiber shift is assumed to be low as well. Ideally, the thickness of the solder on top of the heater should be within [4][5] , so that it can be evaporated with precise thickness control. In our experiments, however, we used 12.5 thick AuSn preform, because we needed greater tolerance in the vertical (transverse) direction to compensate the thickness tolerances of laser submount , fiber ferrule (distance from the axis of the fiber hole to the flat base is ), the fused quartz substrate of the heater , and the solder layers underneath the quartz substrate and the laser submount.…”
Section: Characterization Of Fiber-shift and "Precompensation" Tementioning
confidence: 99%
“…which is an integral part of the fiber sub-assembly, as described in the following section. We have reported earlier about the thermal modeling and fabrication of the thin-film microheaters, which were tested separately outside the package [4]. The main focus of the present paper is to report the concluding part of the earlier work demonstrating the utilization of the thin-film microheater as an integral part of the fiber sub-assembly to achieve high coupling efficiency, as described in the following section.…”
Section: Introductionmentioning
confidence: 99%
“…The wide channel will still favor thermal transpiration because of the cosine law most molecules will travel the distance to reach the height of the channel and collide with the channel wall first and a very few of them which will travel the distance along the width of the channel will collide with each other first before hitting the channel wall. This is even verified by the definition of hydraulic diameter which has to be of the order of the mean free path of the gas for [62]. The channel cover is formed by flip chip bonding glass or silicon to the silicon substrate [63,64].…”
Section: Lateral Design Microfabricated Knudsen Pumpmentioning
confidence: 95%