Design and Fabrication of a Frequency and Polarization Reconfigurable Microwave Antenna on a Printed Partially Magnetized Ferrite Substrate

Ghaffar, Farhan A.; Vaseem, Mohammad; Roy, Langis; Shamim, Atif

doi:10.1109/tap.2018.2846796

Cited by 19 publications

(6 citation statements)

References 22 publications

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“…In wireless communication, reconfigurable components are increasingly important due to their ability to tune it by external stimuli, such as magnetic fields and thermal, electrical, mechanical, and optical factors . For example, smartphones contain multiple antennas that are usually implemented to cover different frequency bands (working frequency determines antenna length), such as global positioning system (GPS), global system for mobile communication (GSM), Wi‐Fi, Bluetooth, 2G/3G, or 4G long‐term evolution (LTE).…”

Section: Resultsmentioning

confidence: 99%

Development of VO₂‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Vaseem

Yang

et al. 2019

Adv Elect Materials

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phase-change temperature. In addition, VO 2 also possesses different polymorphisms, including VO 2 (A), [6] VO 2 (B), [7,8] VO 2 (D), [9] VO 2 (M), [10] VO 2 (R), [11] and VO 2 (P). [12] Among them, the VO 2 monoclinic (M) phase is the most attractive due to its MIT behavior at a relatively low temperature of 68 °C. [13] However, the simultaneous creation of polymorphs results in a mixture phase and makes it extremely difficult to achieve a pure VO 2 (M) phase. The MIT temperature of VO 2 (M) can also be further reduced by doping [14] and by varying the particle sizes. [10,12] This makes VO 2 a promising material for many practical applications, including sensors, [15] thermochromic smart windows, [16] field effect transistors, [17] radio-frequency (RF) switches, [18] terahertz nanoantennas, [19] reconfigurable antennas, [20] memory, [21] and energy. [22,23] Due to the exciting applications mentioned above, considerable effort has been devoted to producing VO 2 (M) in the form of a thin film, primarily with a dry vapor process using chemical vapor deposition, [24] sputtering, [25] metalorganic molecular beam epitaxy deposition, [26] pulsed laser deposition, [27,28] e-beam evaporation, [29] and by electric field inducing ions migration. [30] On the other hand, several bulk nanomaterials in solution processes with different shapes and sizes using sol-gel [31] and hydrothermal synthesis [32] are reported. The VO 2 thin-film deposition techniques using dry vapor processes require an ultrahigh level of vacuum conditions (10 −6 Torr) and sometimes very high processing temperatures (400-600 °C). The process also requires expensive masks and nanolithography for device prototyping. However, the solution-based VO 2 preparation processes are the simplest, require lower processing temperatures, and are highly scalable. Among the solution-based processes, hydrothermal synthesis is the most widely adopted technique due to its high-quality and purephase VO 2 nanomaterial production. [5] The only disadvantage of hydrothermal synthesis is the longer reaction time required, up to 2-4 d, to achieve pure VO 2 (M). For practical applications, VO 2 (M) nanostructures must be deposited in the form of films. Spin coating is one technique to realize VO 2 films, but large-area processing and direct patterning are not possible. [31] With the surge in inkjet printing, which is extremely low cost, completely digital, and highly suitable for rapid prototyping or large-scale manufacturing, realizing VO 2 film through inkjet The metal-insulator transition (MIT) phase change of vanadium dioxide (VO 2 ) materials has facilitated many exciting applications. Among the various crystal phases of VO 2 , the monoclinic (M) phase is the only one that demonstrates low-temperature (≈68 °C) MIT behavior. However, the synthesis of pure VO 2 (M) is challenging because various polymorphs, such as VO 2 (A), VO 2 (B), and VO 2 (D), are also typically formed during the process. Furthermore, to achieve pure crystalline VO 2 (M) phase, very long reaction times, up...

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Section: Resultsmentioning

confidence: 99%

Development of VO₂‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Vaseem

Yang

et al. 2019

Adv Elect Materials

Self Cite

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“…The capability of tuning the permeability tensor through an applied magnetic field means that any RF component realized on this tape system can be tuned or reconfigured. For AiP, this reconfigurability can be in resonant frequency [63], radiation pattern [10], or even in polarization [64]. Such tunable and reconfigurable antennas are highly desirable for the modern wireless communication systems as they can provide diversity and flexibility in the use of available spectrum as well as radiation space.…”

Section: Ferrite Ltcc-based Antennamentioning

confidence: 99%

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Shamim

Zhang

2020

Antenna‐in‐Package Technology and Applications

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Consistent with the SoP concept, AiP is an antenna that is realized on the package of the driving circuit [2]. There are many advantages of AiP that are beneficial for RF systems, the most prominent being the ability of realizing multilayer (vertically integrated) antennas that reduce the overall size of the system. Further, no separate printed circuit boards (PCB) for antenna realization or connections to an external antenna board are required, increasing compactness and cost savings. Finally, efficient antennas can be realized in low loss packaging technologies, particularly at mmWave bands. These aspects are discussed in detail in the coming sections. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. Before moving on to details of AiP design, LTCC technology is introduced in the next section. Section II LTCC Technology LTCC is a multilayer ceramic tape system, which has recently gained popularity not only as a packaging technology but also as an efficient medium to realize passive components. In this section, we first briefly introduce the LTCC technology and then discuss the advantages and issues related to this technology. Later parts of the chapter focus on the LTCC process flow in detail. Finally, we list the major LTCC material suppliers and worldwide service foundries as a quick reference guide for readers.

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“…Traditionally, antennas in mobile handsets were completely un-reconfigurable devices. More recently, adaptive matching networks became common in commercial designs [4], [5], with research pushing towards aperture-tuned devices [6]- [8]. The adaptive matching network introduces the potential to adapt the matching in an optimal fashion, thereby offering the possibility to increase the total efficiency.…”

Section: Recent Advances In Handset Antennasmentioning

confidence: 99%

Advances and Challenges in Handset Antenna Efficiency for 5G and Beyond

Bronckers

Smolders

2020

2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

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Design and Fabrication of a Frequency and Polarization Reconfigurable Microwave Antenna on a Printed Partially Magnetized Ferrite Substrate

Cited by 19 publications

References 22 publications

Development of VO₂‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Development of VO₂‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Advances and Challenges in Handset Antenna Efficiency for 5G and Beyond

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Design and Fabrication of a Frequency and Polarization Reconfigurable Microwave Antenna on a Printed Partially Magnetized Ferrite Substrate

Cited by 19 publications

References 22 publications

Development of VO2‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Development of VO2‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Advances and Challenges in Handset Antenna Efficiency for 5G and Beyond

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Development of VO₂‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink

Development of VO₂‐Nanoparticle‐Based Metal–Insulator Transition Electronic Ink