Design and development of batch fabricatable metal–insulator–metal diode and microstrip slot antenna as rectenna elements

Krishnan, S.; Rosa, Henrry La; Stefanakos, Elias K.; Bhansali, Shekhar; Buckle, K. A.

doi:10.1016/j.sna.2007.04.021

Cited by 72 publications

(45 citation statements)

References 19 publications

(26 reference statements)

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“…The asymmetry is more pronounced when the work function between the two metal electrodes is large. Various combination of dissimilar metals had been investigated in past such as Ni-NiO-Au [8], Ni-NiO-Ni [12], Ti-TiO 2 -Al [13], NiNio-Cr/Au [14], Al-AlO x -Pt [15] Although MIM devices have been studied in great detail for a range of applications, to date their fabrication and implementation in the design of RF circuits on flex substrates has not been investigated. In this paper, we present the design, fabrication and characterization of MIM based RF/Microwave devices on flex substrate, Polyetheretheretherketone (PEEK).…”

Section: Introductionmentioning

confidence: 99%

Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates

Kaur

Yang

Chahal

2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Thispaper demonstrates fabrication and characterization of thin-film Ti-TiO 2 -Pd based MetalInsulator-Metal (MIM) diodes on flexible substrates. MIM diodes with contact areas of 9 µm 2 and 48 µm 2 were fabricated, and a comparison is made for their DC and RF performances. The current-voltage characteristics of the fabricated diodes show strong non-linearity. The diodes are also tested for microwave circuit applications such as detection, frequency multiplication and mixing over a frequency range of 1 -18 GHz. The devices show strong second harmonic frequency multiplication for fundamental frequencies of 1-10 GHz. Details of DC characteristics, RF rectification, mixing and multiplication using MIM diodes are presented. IntroductionThe microwave circuits on flex substrates enable various applications in wireless communication, identification systems, portable/wearable communication devices, wireless power transfer, security and bio-sensing. Flexible electronics have potential advantages over conventional system as they are light weight, large area compatible, enables roll to roll fabrication, low temperature processing and thus very important for low cost manufacturing [1][2][3][4]. Over the last decade, significant work has been carried out on the design and fabrication of RF passive devices on flexible substrates [5,6]. However, direct integration of active components such as diodes and transistors on flex substrates is still a challenge. For applications that require low cost but high-performance RF/Microwave circuitry capable of operating up to several gigahertzs, flexible substrate is a good choice. Many RF applications like portable communications systems require microwave wave antenna arrays integrated with active electronic devices. The cost of assembling passive and active device modules is high as the cost of the individual III-V electronic circuitry is very high. This problem can be solved by integration of passive devices like antenna arrays and highspeed electronics onto large-area, flexible substrates for applications like imaging system. The metal-insulator-metal (MIM) diodes are made entirely of thin film materials i.e. metals and insulators and provide non-linear characteristics dominated by tunneling effects. They can be easily fabricated on wide variety of flexible substrate or even on top of existing CMOS circuitry. Thus RF and microwave devices based on MIM diodes is a promising area of research, as they can operated at very high frequencies, they are simple to implement and process, and a host of metal dielectric combinations can be used to achieve desired diode characteristics. Thus, this allows fabrication of RF circuits onto low cost plastic substrates, which in-turn may be attached to objects of interest like automobile, aircraft or on

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Section: Introductionmentioning

confidence: 99%

Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates

Kaur

Yang

Chahal

2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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“…The asymmetry factor improves rectification. To compare with our results, recent measurements of the sensitivity are listed in Table I, taken from [12].…”

Section: Experiments Resultsmentioning

confidence: 97%

New Process Development for Planar-Type CIC Tunneling Diodes

Choi

Yesilköy

Chryssis

et al. 2010

IEEE Electron Device Lett.

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A planar-type conductor-insulator-conductor tunneling diode is developed using a boiling water process for surface oxidation. First, microsized bow-tie patterns are transferred on a doped polysilicon layer using e-beam lithography. After reactive ion etching, the polysilicon bow-tie pattern has a very narrow knot between two triangles. Using a buffered oxide etchant (BOE) solution, hydrogen silsesquioxane patterns and native oxide layer are etched. The knot is oxidized by a boiling water oxidation process. By repeating the BOE etch and oxidation, the bow-tie patterns are transformed into tunneling diodes with a very thin oxide barrier separating two polysilicon conductors. We show that the resulting structures follow the Simmons tunneling current-voltage relationship after boiling. Moreover, a high sensitivity of 31 V −1 is achieved at a bias voltage of 80 mV.Index Terms-Bow-tie antenna, metal-insulator-metal (MIM) diode, optical antenna, surface plasmon, surface plasmon resonance (SPR), tunneling diode.

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“…However due to a lack of asymmetry, the second Ni electrode must be replaced with a metal of different work function in order to achieve rectification. This has been investigated by Hoofring et al [51], Krishnan et al [52,53] and Esfandiari et al [54] with Au, Cr and Pt contacts respectively, all displaying good asymmetrical I-V response. Other structures of dissimilar materials which have shown promising results are Al/Al2O3/Ni [55,56], Nb/Nb2O5/Pt [57,58,59], ZrCuAlNi/Al2O3/Al [60] and also Nb/Nb2O5/Ag [61].…”

Section: Rectifying Elementmentioning

confidence: 92%

Nano Energy Harvesting with Plasmonic Nano-Antennas: A review of MID-IR Rectenna and Application

Citroni

Leggieri²,

Passi³

et al. 2017

AEM

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Drones, a technical nickname for unmanned aerial vehicles (UAVs) are gaining more and more interest and popularity. Supported by the miniaturization and cost reduction of electronic components, a new class of UAVs called Nano-air vehicles or NAVs represent the future technology for indoor and outdoor mission. One of the main considerations when building or buying a drone is the flight time and range. The flight time is nowadays a drawback for miniature unmanned aerial vehicles (UAVs). It is limited to a few minutes before requiring a forced recovery to replace exhausted batteries. Currently the batteries are the dominant technology, which possess limited operation in time and energy. The real viability to extending flight time (FT) of NAVs is possibly exploring new and more disruptive alternative solution able either to recharge a battery, or even to directly power the NAVs during the flight. A Plasmonic Nano Energy harvester is an attractive technology to extending the FT extracting the energy in mid-infrared radiation emitted from Earth's surface with Rectenna tuned to mid-infrared wavelengths (7 -14 ) m µ with a peak wavelength of about10 m µ . In this review the concepts emerging from this work identify and suggest how this novel harvester can constantly supply these flying objects for the whole day.

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Design and development of batch fabricatable metal–insulator–metal diode and microstrip slot antenna as rectenna elements

Cited by 72 publications

References 19 publications

Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates

Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates

New Process Development for Planar-Type CIC Tunneling Diodes

Nano Energy Harvesting with Plasmonic Nano-Antennas: A review of MID-IR Rectenna and Application

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