Design and Demonstration of a Photonic Integrated Glass Interposer for Mid-Board-Optical Engines

Neitz, Marcel; Wöhrmann, Markus; Zhang, Ruiyong; Fikry, Mohamed; Marx, Sebastian; Schröder, Henning

doi:10.1109/ectc.2017.254

Cited by 7 publications

(5 citation statements)

References 5 publications

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“…This is due to the scalability and flexibility in assembly of the photonic and electronic interconnects associated with this approach. The electrical losses can be reduced by using a suitable low-loss material such as high resistivity silicon, LTCC or glass , as an interposer for the RF and DC connections. The thermal management of the PIC also becomes relatively easier in this case because the thermal conductivity of the interposer is much higher than that of the PCB and it can be placed directly on a thermoelectric cooler (TEC).…”

Section: Electronic–photonic Co-packagingmentioning

confidence: 99%

“…The research trend is now turning toward glass interposers ,,, (see Figure ), which, in addition to demonstrating low-electrical loss, offer good coefficient of thermal expansion (CTE) matching, mechanical stability, and scalability for panel-level packaging where the cost of assembly can be reduced by a factor of 10 114 . As silicon and LTCC have better thermal conductivity than glass, copper vias have to be incorporated to improve thermal management.…”

Section: Electronic–photonic Co-packagingmentioning

confidence: 99%

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Integrated Photonics Packaging: Challenges and Opportunities

et al. 2022

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Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

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Section: Electronic–photonic Co-packagingmentioning

confidence: 99%

Section: Electronic–photonic Co-packagingmentioning

confidence: 99%

Integrated Photonics Packaging: Challenges and Opportunities

et al. 2022

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“…Glass properties and drivers for the use of glass as integration platform material. [5][6][7][8] The suitability in regard to system integration and optical interconnect capability are marked using different fonts (bold: suitable, italic: medium, and bold italic: disadvantageous).…”

Section: Tablementioning

confidence: 99%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

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Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems for communication, computing, medical, and sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, and optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, and micro-lenses. Such glassbased substrates can be thin glass layers on large panels or more mini-bench-like boards that can be embedded into organic printed circuit boards (PCBs). Optical fiber interconnects, connectors, and electrical-optical integration platforms are used for higher level system integration and need to be miniaturized on module and board level to fulfill decreasing channel pitch requirements. We provide background on and discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, the related high precision assembly techniques, and advanced fiber interconnects. Some examples of PCB photonic integration, micro-bench optical sub-assemblies, including PIC, and 3D optical resonator packages that combine most of these approaches will be shown. © The Authors.Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Section: B Mid Board Opticsmentioning

confidence: 99%

“…In a move towards replacing copper-based interconnects and exploiting optical printed circuit boards [18] for interconnecting various on board IT elements, boarddetachable optical transceivers in the form of MBOs are seen as an attractive solution. These MBOs look to be set to replace front face pluggable transceivers [18]. This type of transceiver enables better utilization of front panel space, it leads to a better dissipation of heat and it allows for deployment of the optical transceiver ever closer to the IT element hence reducing the electrical interfaces between them which will minimize latency and electrical signal parasitic.…”

Section: B Mid Board Opticsmentioning

confidence: 99%

MCF-SMF Hybrid Low-Latency Circuit-Switched Optical Network for Disaggregated Data Centers

Saljoghei

Yuan

Mishra

et al. 2019

J. Lightwave Technol.

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This paper proposes and experimentally evaluates a fully developed novel architecture with purpose built low latency communication protocols for next generation disaggregated data centers (DDCs). In order to accommodate for capacity and latency needs of disaggregated IT elements (i.e. CPU, memory), this architecture makes use of a low latency and high capacity circuit switched optical network for interconnecting various endpoints, that are equipped with multi-channel Silicon photonic based integrated transceivers. In a move to further decrease the perceived latency between various disaggregated IT elements, this paper proposes a) a novel network topology, which cuts down the latency over the optical network by 34% while enhancing system scalability and b) channel bonding over multicore fiber (MCF) switched links to reduce head to tail latency and in turn increase sustained memory bandwidth for disaggregated remote memory. Furthermore, to reduce power consumption and enhance space efficiency, the integration of novel multi core fiber (MCF) based transceivers, fibers and optical switches are proposed and experimentally validated at the physical layer for this topology. It is shown that the integration of MCF based subsystems in this topology can bring about an improvement in energy efficiency of the optical switching layer which is above 60%. Finally, the performance of this proposed architecture and topology is evaluated experimentally at the application layer where the perceived memory throughput for accessing remote and local resources is measured and compared using electrical circuit and packet switching. The results also highlight a multi fold increase in application perceived memory throughput over the proposed DDC topology by utilization and bonding of multiple optical channels to interconnect disaggregated IT elements that can be carried over MCF links.

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Design and Demonstration of a Photonic Integrated Glass Interposer for Mid-Board-Optical Engines

Cited by 7 publications

References 5 publications

Integrated Photonics Packaging: Challenges and Opportunities

Integrated Photonics Packaging: Challenges and Opportunities

Hybrid photonic system integration using thin glass platform technology

MCF-SMF Hybrid Low-Latency Circuit-Switched Optical Network for Disaggregated Data Centers

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