“…wafers using low thermal budget or reduced high temperature processing steps help with cost and energy savings in device fabrication. CMOS pyroelectric materials [33] include hafnium oxide (HfO 2 )-based, [34,35] gallium nitride (GaN)based, [36,37] aluminum nitride (AlN)-based, [38][39][40] and zinc oxide (ZnO)-based. [41] Among these materials, AlN and its doped counterpart scandium aluminum nitride (ScAlN) are attractive due to its high Curie temperatures above 1000 °C [38,42] and have not only piezoelectric, pyroelectric, and ferroelectric properties, [43,44] but also suitable for photonics from UV to mid-IR wavelengths [45,46] and power electronics.…”