Design and CAD for 3D integrated circuits

Franzon, Paul D.; Davis, W. Rhett; Steer, M.B.; Lipa, S.; Oh, Eun Chu; Thorolfsson, Thorlindur; Melamed, Samson; Luniya, Sonali R.; Doxsee, Tad; Berkeley, Stephen; Shani, Ben; Obermiller, Kurt

doi:10.1145/1391469.1391642

Cited by 17 publications

(6 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, none of these works present a general model to encapsulate the global physical architecture to enable design space exploration. In [11] the authors stipulated that the performance advantage of 3-D over 2-D ICs would shrink as feature size decreased below 65 nm, however recent work [12] analyzing the performance of a 16-core stacked IC and our own study has shown that in fact the advantage of 3-D ICs grows in lower technology nodes. An outlook of processor power and cooling strategies for 2-D and 3-D ICs as feature size scales is given in [13].…”

Section: Related Workmentioning

confidence: 98%

Modeling the computational efficiency of 2-D and 3-D silicon processors for early-chip planning

Grange

Jantsch

Weerasekera

et al. 2011

2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

View full text Add to dashboard Cite

Hierarchical models from physical to system-level are proposed for architectural exploration of high-performance silicon systems to quantify the performance and cost trade offs for 2-D and 3-D IC implementations. We show that 3-D systems can reduce interconnect delay and energy by up to an order of magnitude over 2-D, with an increase of 20-30% in performance-per-watt for every doubling of stack height. Contrary to previous analysis, the improved energy efficiency is achievable at a favorable cost. The models are packaged as a standalone tool and can provide fast estimation of coarse-grain performance and cost limitations for a variety of processing systems to be used at the early chip-planning phase of the design cycle.

show abstract

Section: Related Workmentioning

confidence: 98%

Modeling the computational efficiency of 2-D and 3-D silicon processors for early-chip planning

Grange

Jantsch

Weerasekera

et al. 2011

2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

View full text Add to dashboard Cite

show abstract

“…Three-dimensional integrated circuits (3DICs) provide enhanced performance and device density gains [1] beyond that available from technology scaling alone. The 3DIC architecture is one of the potential circuit architectures that overcomes some of the challenges of interconnect scaling by exploiting the vertical dimension [2].…”

Section: Introductionmentioning

confidence: 99%

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

Priyadarshi

Harris

Melamed

et al. 2012

IET Circuits Devices Syst.

View full text Add to dashboard Cite

Physics-based compact electrothermal macromodels of standard cells are developed for fast dynamic simulation of three-dimensional integrated circuits (3DICs). Such circuits can have high thermal densities and thermal effects often limit their performance. The macromodels developed here use fewer state-variables than a discrete transistor-level implementation while retaining transistor-level accuracy. This results in significant speed-up over transistor-level simulation for large-scale circuits. The macromodel-based methodology enables robust and significantly faster dynamic electrothermal simulation over the long times required for thermal transients to subside. Consequently, transient junction temperature can be examined in the design phase. Simulated junction and measured surface thermal transients are compared.

show abstract

“…In the context of GPPs, interface between the L2 cache and main memory is architected using 3D interconnect technology, and performance is compared to a 2D design for memoryintensive applications [6][7][8][9][10]. In the context of FPGAs, a number of recent studies have shown that 3D FPGAs have better performance than existing 2D designs [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Domain-specific processor with 3D integration for medical image processing

Cong

Guruaj

Huang

et al. 2011

ASAP 2011 - 22nd IEEE International Conference on Application-Specific Systems, Architectures and Processors

View full text Add to dashboard Cite

Abstract-The growth of 3D technology had led to opportunities for stacked multiprocessor-accelerator computing platforms with highbandwidth and low-latency TSV connections between them, resulting in high computing performance and better energy efficiency. This work evaluates the performance and energy benefits of such an advanced architecture and addresses associated design problems. To better utilize the reconfigurable hardware resource and to explore the opportunity of kernel sharing across applications, we propose to use a dedicated domain-specific computing platform. In particular, we have chosen medical image processing as the domain in this work to accelerate due to its growing for real-time processing demand yet inadequete performance on conventional computing architectures. A design flow is proposed in this work for the 3D multiprocessoraccelerator platform and a number of methods are applied to optimize the average performance of all the applications in the targeted domain under area and bandwidth constraints. Experiments show that the applications in this domain can gain a 7.4x speed-up and 18.8x energy savings on average running on our platform using CMP cores and domain-specific accelerators as compared to their counterparts coded in CPU only.

show abstract

Design and CAD for 3D integrated circuits

Cited by 17 publications

References 6 publications

Modeling the computational efficiency of 2-D and 3-D silicon processors for early-chip planning

Modeling the computational efficiency of 2-D and 3-D silicon processors for early-chip planning

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

Domain-specific processor with 3D integration for medical image processing

Contact Info

Product

Resources

About