2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2023
DOI: 10.1109/epeps58208.2023.10314927
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Design and Analysis of Redistribution Layer Interposer Channel Considering Signal Integrity for High Bandwidth Memory Module

Jiwon Yoon,
Hyunwook Park,
Hyunwoo Kim
et al.
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