Design and Analysis of Interdigital Electrode Parallel Layout of Multilayer SAW Devices

Abstract

To obtain high-frequency SAW devices, the interdigital transducer electrodes are prepared narrower and the electrode spacing is smaller, which leads to higher cost and lower reliability of highfrequency SAW devices. In this paper, two other interdigital electrode parallel layout structures are designed based on the traditional IDT flat layer layout structure, and the influence of the three different IDT electrode layout structures on the SAW device of LiNbO3/Diamond/Si multilayer structure is studied by COMSOL Multiphysics. The results show that the designed multi-layer structure SAW device can successfully excite SAW with superior performance, and the parallel layout structure of the interdigital electrode can reduce the lateral size of SAW device, which provides a new idea and direction for the miniaturization of the SAW devices.INDEX TERMS design optimization; finite element analysis (FEA); interdigital transducer (IDT); multilayer structure; surface acoustic wave (SAW)