2022
DOI: 10.1007/s11664-022-09646-z
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Design and Analysis of a Field Plate Engineered High Electron Mobility Transistor for Enhanced Performance

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Cited by 2 publications
(1 citation statement)
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“…The various physical parameters of various materials like silicon, Gallium arsenide, Gallium nitride, Silicon carbide, Gallium oxide and Diamond are depicted in Table I [21]- [23]. The material properties of GaN are very unique and superior to conventional material systems such as a lower intrinsic concentration and therefore lower leakage and noise related problems ensuring a high temperature operation besides higher critical electric field for high power breakdown applications due to its wide bandgap [24], [25]. The higher saturation velocity manifests into higher current capacity.…”
Section: Gan Properties and Hemt Basicsmentioning
confidence: 99%
“…The various physical parameters of various materials like silicon, Gallium arsenide, Gallium nitride, Silicon carbide, Gallium oxide and Diamond are depicted in Table I [21]- [23]. The material properties of GaN are very unique and superior to conventional material systems such as a lower intrinsic concentration and therefore lower leakage and noise related problems ensuring a high temperature operation besides higher critical electric field for high power breakdown applications due to its wide bandgap [24], [25]. The higher saturation velocity manifests into higher current capacity.…”
Section: Gan Properties and Hemt Basicsmentioning
confidence: 99%