2016
DOI: 10.1002/ppap.201500214
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Deposition of Poly(Ethylene Oxide)‐Like Plasma Polymers on Inner Surfaces of Cavities by Means of Atmospheric‐Pressure SDBD‐Based Jet

Abstract: The jet of reactive effluents produced by surface dielectric barrier discharge was used to deposit PEOlike plasma polymers from di(ethylene) glycol vinyl ether. The jet was confined within the hollow space of either circular cross-section with substrate placed perpendicular to the jet, or rectangular cross-section with the walls used as substrates. The best 67% retention of the ethers was obtained for the circular channel, whereas it was only 50% for the rectangular channel. In the latter case, deposition at l… Show more

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Cited by 9 publications
(13 citation statements)
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“…In Figure b, ΔIfluo is plotted as a function of PEG character expressed as XPS C 1s % C‐OR. Based on BSA adsorption assays, we note that a PEG character close to 60% may suffice for anti‐fouling, a value somewhat below the so‐far accepted 65% threshold for plasma polymers . The current results are somewhat inferior to those of Nisol et al (ca.…”
Section: Resultscontrasting
confidence: 89%
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“…In Figure b, ΔIfluo is plotted as a function of PEG character expressed as XPS C 1s % C‐OR. Based on BSA adsorption assays, we note that a PEG character close to 60% may suffice for anti‐fouling, a value somewhat below the so‐far accepted 65% threshold for plasma polymers . The current results are somewhat inferior to those of Nisol et al (ca.…”
Section: Resultscontrasting
confidence: 89%
“…This strongly endorses the protein adsorption assay as a probe for anti‐fouling surface properties and also confirms the necessity to maximize the coating's PEG character by way of well‐controlled PP processing. The present methodology also allowed us to achieve a new (lower) minimum threshold value of PPs’ PEG character, namely ≈ 59% compared with the hitherto accepted 65% value …”
Section: Resultsmentioning
confidence: 99%
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“…This method is becoming increasingly important, since many elemental and compound material films, such as SiNx:H, SiO 2 , SiC, and SiSi 3 N 4 , can be prepared at low temperature. The film deposition using AP‐PECVD has been realized by atmospheric‐pressure dielectric barrier discharges (AP‐DBD), atmospheric‐pressure plasma jets (APPJ), and radio frequency glow discharges . Among them, parallel‐plate AP‐DBD shows good stability and scalability, and is among the most promising techniques for thin film deposition…”
Section: Introductionmentioning
confidence: 99%