Deposition of gold without external current source

Simon, F.O.

doi:10.1007/bf03214724

Cited by 16 publications

(9 citation statements)

References 1 publication

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“…The ratio of hydroxide to DMAB is very important for electroless gold deposition. Primarily, the reducing agent DMAB needs alkaline media in order to generate the trihydrohydroxy borate ion BH 3 OH - , The boron in BH 3 OH - has a valency of −3 and can act as an electron donor. The overall electroless gold deposition process in alkaline solution is generally represented as 18,19 The formation of the “true” reducing agent, BH 3 OH - , depends on the pH of the solution as shown in eq 1.…”

Section: Resultsmentioning

confidence: 99%

Impedance and Morphological Properties of Electroless Gold on Industrial Metal Coupons

and

Sadik

2001

Langmuir

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An approach for correlating the bath chemistry during electroless gold deposition with the overall plating quality on industrial wirebond samples is presented. Electrochemical impedance spectroscopy of the reducing agent dimethylamine borane (DMAB) on gold in alkaline solution was used to provide qualitative information on the interfacial adsorption/desorption processes occurring during deposition. Depending on hydroxide and DMAB concentration, impedance data obtained under hydrodynamic conditions at the gold oxide reduction potential (0.184 V vs Ag/AgCl) follow two different equivalent circuit models that do not exhibit contribution from diffusion. Gold deposit quality was assessed with scanning electron microscopy and energy-dispersive spectrometry under a variety of bath compositions. Finally, bath efficiency was evaluated in terms of plating rate obtained from X-ray fluorescence data. The substrate surface/solution interactions are linked to the final quality of the resulting gold layer. This work shows that substrate incompatibility and the ratio imbalance between gold and the reducing agent concentrations produce thin, dull deposits. Maintaining the optimum ratio of DMAB/KOH provides balance in the bath chemistry necessary for efficient plating.

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Section: Resultsmentioning

confidence: 99%

Impedance and Morphological Properties of Electroless Gold on Industrial Metal Coupons

and

Sadik

2001

Langmuir

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“…To be most cost-effective on the one hand and to develop electroconductive yarns that are highly reliable on the other hand, we regarded the coating of a thin layer of gold on a textile yarn is a well chosen compromise. Among the various available gold coating techniques [29][30][31], we chose electroless deposition [32][33][34][35] for the present work due to its rapidity and simplicity (no current needs to be applied), as well as to its non-destructiveness given the sensitive materials to be coated [21]. The combination of this process and these materials is unique according to our knowledge.…”

Section: Introductionmentioning

confidence: 99%

Gold coated para-aramid yarns through electroless deposition

Schwarz

Hakuzimana

Kaczynska

et al. 2010

Surface and Coatings Technology

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“…The oxidation state of boron in this first intermediate is +3. The overall electroless gold deposition process in alkaline solution is generally reported as [6,7] …”

Section: Introductionmentioning

confidence: 99%