“…Numerous studies have been conducted so far to overcome these problems with the goal of substituting ITO with metal-doped ZnO. To further lower the resistivity and flatten the resistivity spatial distribution, it is reported that the following are effective: addition of hydrogen gas, 13,14) substrate heating during film formation, 15,16) post annealing, 17) formation of an intermediate buffer layer between thin film and substrate, [18][19][20] off-axis arrangement of substrate, 21) use of facing targets, 22,23) superposition of DC and RF, 16,[24][25][26] utilization of inductively coupled plasma assist, [27][28][29] installation of mesh grid between target and substrate, 30) etc.…”