Abstract:A porous Cu layer was deposited on a dummy Cu die and a dummy substrate, respectively, by electroplating to form a bondline that can endure high temperatures, such as 300 ℃. The plating at a current density of 40 mA/cm<sup>2</sup> in a plating solution containing a crystal controlling agent resulted in different porous layers from fine dendritic grains to coarse a typical grains and an increased layer thickness with increasing plating time. Die-attachment sinter bonding at 5 MPa and 300 ℃ in the ai… Show more
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