Deposition and Reflow of Phosphosilicate Glass

Bowling, R. A.; Larrabee, Graydon B.

doi:10.1149/1.2113749

Cited by 37 publications

(23 citation statements)

References 14 publications

(27 reference statements)

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“…Due to electrical shielding [16,18], the van der Waals force is reduced, in our case, by about a factor of two; capillary forces are nullified, and direct hydrogen bonding from particle to surface may be replaced by bonding to free water molecules. This is one reason why surface vibrations having the same amplitudes, as shown in Figures 3(b) and (c), could remove Si02 particles only during steam cleaning; the values of the adhesion forces for Si02 during steam cleaning are also given in Table I.…”

Section: Discussionmentioning

confidence: 75%

Excimer Laser Induced Removal of Particles from Hydrophilic Silicon Surfaces

Sacher

Meunier

1999

The Journal of Adhesion

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A pulsed KrF excimer laser was used to remove several types of submicron-sized particles from silicon surfaces. Polystyrene latex particles, 0.1 pm and larger, were removed from silicon surfaces by dry laser cleaning (no water layer condensed on the surface) but Si02 particles could not be so removed. However, during steam laser cleaning, in which a thin film of water is deposited on the surface as both an energy transfer medium and an adhesion force reduction agent, these 0.1 -0.2 pm SiOz particles were almost entirely removed. Calculations of the various forces contributing to adhesion indicate that hydrogen bonds are the major contributor to the adhesion of inorganic particles to substrate surfaces. Photoacoustic detection, using piezoelectric transducers, monitored the surface vibrations induced by the laser pulses.

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Section: Discussionmentioning

confidence: 75%

Excimer Laser Induced Removal of Particles from Hydrophilic Silicon Surfaces

Sacher

Meunier

1999

The Journal of Adhesion

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“…Many studies have been carried out to unravel the interactions that occur in particulate adhesion and removal. [9][10][11][12][13][14][15] Most of them considered either adhesion or removal. In our present article, we do both.…”

Section: Introductionmentioning

confidence: 99%

The modeling of excimer laser particle removal from hydrophilic silicon surfaces

Wu¹,

Sacher²,

Meunier³

2000

Journal of Applied Physics

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We summarize experimental results on the successful removal of submicron-sized polystyrene latex, carboxylate-modified latex, SiO 2 , and Al 2 O 3 particles from hydrophilic silicon surfaces by excimer laser, using both dry and steam cleaning; the cleaning and damage thresholds have also been determined for these particles. Adhesion and removal models for an ideal sphere particle, that include van der Waals forces, hydrogen bonding, and thermoelastic effects, theoretically explain the laser cleaning results. Two models of the removal force due to the explosive evaporation of liquid film have been calculated and compared. The effects of both asperities on the particle surface and particle aggregation have also been considered. The results of the calculations show that even those surface asperities which are small compared with the particle dimension can cause a large reduction in both adhesion and thermoelastic removal forces. The theoretical predictions are consistent with the experimental observations.

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“…3 Much work has been done to describe adhesion forces between particle and substrate surface. [4][5][6][7] This work has led to the conclusion that van der Waals, capillary, and electrostatic adhesion forces are the major contributors. Chemical bonds at the contact area between the adherents are so far accounted for only qualitatively, 4,5,8,9 although they may play an important role on the silicon surface, because a quantitative treatment of chemical bonds between particle and substrate surface is very difficult.…”

Section: Introductionmentioning

confidence: 99%