Dependence of texture evolution on initial orientation in drawn single crystal copper

Chen, J.; Wen, Yan; Liu, C.X.; Ding, Rengen; Fan, Xing

doi:10.1016/j.matchar.2010.12.006

Cited by 50 publications

(21 citation statements)

References 23 publications

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“…In copper and copper alloys, the intensity of 1 0 0 fiber texture decreases with increasing strain as reported by Hibbard [19]. The results showed that 1 1 1 is a stable texture in FCC materials [20].…”

supporting

confidence: 68%

Experimental and numerical investigations of the texture evolution in copper wire drawing

2012

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Polycrystalline copper wires are drawn in a single and multiple step for the equivalent area reduction (RA) of ∼33% The single step and multiple step drawing process was simulated using a rate independent crystal plasticity with finite strain, which is implemented as a user routine in commercial finite element package ABAQUS. The texture of the copper wires were characterized by X-ray diffraction (XRD) and compared with the texture based finite element (FE) simulation predictions. Initial 10 0 fiber decreases during the drawing process and is replaced by 1 1 1 fiber. The 1 1 1 oriented grains are predominant in a single step drawing compared to a multiple step of the equivalent area reduction. The finite element analysis takes into account active crystallographic slip and orientation effects during the drawing process. Regions at the interface of diewire exhibited complex textures, which was widely seen in the multiple step drawing pattern.

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supporting

confidence: 68%

Experimental and numerical investigations of the texture evolution in copper wire drawing

2012

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“…In copper and copper alloys, the intensity of 1 0 0 fiber texture decreases with increasing strain as reported by Hibbard [33]. The results showed that 1 1 1 is a dominating texture in FCC materials [34]. The fiber texture effect on the mechanical properties of the drawn wire is shown in Figure 1…”

Section: Crystallographic Texture and Its Effectssupporting

confidence: 57%

Modeling of microstructure evolution during cold wire drawing process and properties determination

Narayanan¹

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Wire drawing is the most widely employed process for manufacturing the micrometer sized gold wire (φ10 − φ50 µm) used for electronic interconnects. Currently, gold wire is applied in the bonding pad and miniaturization has resulted in need of higher quality of wire; wire quality is dependent on mechanical properties. The mechanical properties are based on microstructural behavior. This work was performed during my Ph.D candidature at Nanyang Technological University, Singapore. This thesis would not have been possible without the cooperation and time of many people, whom I owe my deepest gratitude to. • My greatest thanks are reserved for my supervisor Associate Professor Sridhar Idapalapati whose help shall remain understated. His enthusiasm, inspiration and encouragement rubs off on students motivating us to perform better. His sound advice, constructive criticisms and his ability to explain things in a lucid manner shall always be remembered. • I would also like to thank Assistant Professor Sathyan Subbiah for co-advising this thesis. His efforts in guiding the thesis was amazing. It was an exorbitant privilege working with him. • My committee members Associate Professors Liu Er Jia, Tang Ming Jen and Assistant Professor Castagne Sylvie for overlooking my thesis work. • My special thanks to our subject librarian Mr. Ramaravikumar Ramakrishnan for providing me all the necessary resources for doing this Ph.D research. The library walk thru and ENDNOTE workshops were extremely helpful. His affable and risible attitude will always be remembered. • Thanks to Ms. Yong Mei Yoke for helping me with the SEM, Mr. Leong Kwok Phui for assisting me with the XRD and Dr. Zviad of the MSE school with the pole figure measurements. Mr. Teo Hai Beng for setting my LINUX cluster without which my simulations would never have happened.

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“…For FCC metals with medium to high SFE, the copper-type texture is dominant, but for FCC metals with low SFE, the brass-type texture will be developed, which suggests that SFE is an important factor to affect texture evolution. Previous studies of drawn FCC metals with medium to high SFE show that duplex fiber textures consisting of <111> and <100> form at high strains and <111> and <100> parallel to the axis direction of wires are stable orientations [12][13][14][15][16]. For polycrystalline Ag with low SFE, grains will also rotate to <111> or <100> parallel to the axis direction of wires during cold drawn process ( Figure 5).…”

Section: Deformation Texturementioning

confidence: 85%

“…In addition to the formation of these dislocation boundaries, the crystal will rotate during cold drawn process. For FCC metals with medium to high SFE, duplex fiber textures of <100> and <111> parallel to the axis direction form [16][17][18][19][20]. Therefore, it can be considered that <100> and <111> are stable crystal orientation for cold-drawn FCC metals with medium to high SFE.…”

Section: Introductionmentioning

confidence: 99%

Evolution of microstructure and texture of cold-drawn polycrystalline Ag with low stacking fault energy

Chen

et al. 2015

Sci. China Technol. Sci.

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The evolution of microstructure and texture for drawn polycrystalline Ag was investigated by transmission electron microscopy and electron backscattering diffraction. The results show that there are deformation twins and some un-tangled discrete dislocations at low strains. When the strain is increased to 0.58, a lot of high density dislocation walls and microbands come into being. At the same time, some twins lose the twinning relationship of 60°<111>. At a strain of 0.94, both dislocation boundaries and twin boundaries will rotate to the axis direction of wires and the shear bands start to appear. When the strain is higher than 1.96, most of the boundaries are parallel to the drawn direction. Texture analysis indicates that with the strain increasing, the volume fraction of complex texture component decreases, but <111> and <100> texture components increase. However, the variation in the volume fraction of each texture component as strains is not evident when the strains are higher than 0.58. For polycrystalline Ag with low stacking fault energy, complex texture components are easily formed.polycrystalline Ag, cold-drawn deformation, microstructure, deformation twinning, stacking fault energy Citation:Ma X G, Chen J, Chen Z, et al. Evolution of microstructure and texture of cold-drawn polycrystalline Ag with low stacking fault energy.

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Dependence of texture evolution on initial orientation in drawn single crystal copper

Cited by 50 publications

References 23 publications

Experimental and numerical investigations of the texture evolution in copper wire drawing

Experimental and numerical investigations of the texture evolution in copper wire drawing

Modeling of microstructure evolution during cold wire drawing process and properties determination

Evolution of microstructure and texture of cold-drawn polycrystalline Ag with low stacking fault energy

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