Dependence of stress intensity factors on elastic constants for cracks in an orthotropic bimaterial with a thin film

Beom, Hyeon Gyu; Cui, Cheng Bin; Jang, Ho Su

doi:10.1016/j.ijsolstr.2012.08.002

Cited by 17 publications

(12 citation statements)

References 22 publications

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“…An example of one such model is [56] which analysed the interior edge crack in an orthotropic bi layer strip. Later, the influences of delaminations evolving at the edge/corner of film-substrate system considering orthotropic bi layer strip was analysed in [57,58] however, these models were limited to homogeneous layers.…”

Section: Indentation -Induced Interior Edge Delaminationmentioning

confidence: 99%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents the suggestions for improvements in existing analysis techniques to overcome some of the limitations in film failure modelling. This comprehensive review will help researchers, scientists, and academics to understand, develop and improve the existing models and methods of film-substrate systems.

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Section: Indentation -Induced Interior Edge Delaminationmentioning

confidence: 99%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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“…Beom el al introduced the function G(z) as

G ((), z) = B f^{'} ((), z) = B ([], \begin{array}{c} f_{1}^{'} & ((), z) \\ f_{2}^{'} & ((), z) \end{array}),

where Equation is a modified version of the Stroh formalism and is also applicable to a degenerate orthotropic material. Muskhelishvili showed that for 2D in‐plane linear elastic, homogeneous, and isotropic materials, the displacements and stresses can also be defined using 2 complex functions γ j ( z ) as shown below.…”

Section: Stress‐strain Relations For Plane Elasticity: Anisotropic Vsmentioning

confidence: 99%

“…As discussed in Tafreshi, a variety of numerical algorithms are available for analysis of debonded isotropic bimaterials and fracture in homogeneous solids. However, in anisotropic bimaterials with interfacial cracks, the traction and displacement data close to the crack tip are commonly used to compute SIFs . Therefore, a very fine mesh in these regions is usually used.…”

Section: Introductionmentioning

confidence: 99%

A unified and integrated numerical‐analytical approach for evaluation of J_k‐integrals of an interfacial crack in orthotropic and isotropic bimaterials

Tafreshi

2018

Fatigue Fract Eng Mat Struct

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A new unified and integrated method for the numerical‐analytical calculation of Jk‐integrals of an in‐plane traction free interfacial crack in homogeneous orthotropic and isotropic bimaterials is presented. The numerical algorithm, based on the boundary element crack shape sensitivities, is generic and flexible. It applies to both straight and curved interfacial cracks in anisotropic and/or isotropic bimaterials. The shape functions of semidiscontinuous quadratic quarter point crack tip elements are correctly scaled to adapt the singular oscillatory near tip field of tractions. The length of crack is designated as the design variable to compute the strain energy release rate precisely. Although an analytical equation relating J1 and stress intensity factors (SIFs) exists, a similar relation for J2 in debonded anisotropic solids for decoupling SIFs is not available. An analytical expression was recently derived by this author for J2 in aligned orthotropic/orthotropic bimaterials with a straight interface crack. Using this new relation and the present computed Jk values, the SIFs can be decoupled without the need for an auxiliary equation. Here, the aforementioned analytical relation is reconstructed for cubic symmetry/isotropic bimaterials and used with the present numerical algorithm. An example with known analytical SIFs is presented. The numerical and analytical magnitudes of Jk for an interface crack in orthotropic/orthotropic and cubic symmetry/isotropic bimaterials show an excellent agreement.

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“…For an interfacial crack in anisotropic bimaterials, the displacement and traction data near the crack tip are usually employed to compute SIFs. [31][32][33][34][35][36] This paper presents a new analytical expression relating the J 2 -integral and the SIFs in an in-plane tractionfree crack between two orthotropic elastic solids using the complex function method. Using this new analytical expression, in conjunction with the values of J k , allows for the computation of the corresponding SIFs without the need for an auxiliary relation.…”

Section: Introductionmentioning

confidence: 99%

An analytical expression for the J₂‐integral of an interfacial crack in orthotropic bimaterials

Tafreshi

2017

Fatigue Fract Eng Mat Struct

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Dependence of stress intensity factors on elastic constants for cracks in an orthotropic bimaterial with a thin film

Cited by 17 publications

References 22 publications

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

A unified and integrated numerical‐analytical approach for evaluation of J_k‐integrals of an interfacial crack in orthotropic and isotropic bimaterials

An analytical expression for the J₂‐integral of an interfacial crack in orthotropic bimaterials

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Dependence of stress intensity factors on elastic constants for cracks in an orthotropic bimaterial with a thin film

Cited by 17 publications

References 22 publications

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

A unified and integrated numerical‐analytical approach for evaluation of Jk‐integrals of an interfacial crack in orthotropic and isotropic bimaterials

An analytical expression for the J2‐integral of an interfacial crack in orthotropic bimaterials

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A unified and integrated numerical‐analytical approach for evaluation of J_k‐integrals of an interfacial crack in orthotropic and isotropic bimaterials

An analytical expression for the J₂‐integral of an interfacial crack in orthotropic bimaterials