Dependence of Device Performances on Fin Ratios of AlGaN/GaN Nanoscale Fin-HEMTs
Yu-Jun Lai,
Hong-Che Lin,
Yu-Chen Liu
et al.
Abstract:We report the fabrication and characterization of AlGaN/GaN fin-type high electron mobility transistors (Fin-HEMTs) grown on high-resistance silicon substrates. The Fin-HEMTs have a gate length of 125 nm by using electron-beam lithography with various fin ratios, which are defined as the total effective periodic gate widths over the gate width, along the whole gate width. The Fin-HEMTs are designed with three fin ratios of 0.5, 0.3, and 0.25. The on-resistance decreases with reducing the fin ratio and reaches … Show more
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