Densification and properties investigation of W-Cu composites prepared by electroless-plating and activated sintering

Li, Yuan; Zhang, Jian; Luo, Guoqiang; Shen, Qiang; Zhang, Lianmeng

doi:10.1016/j.ijrmhm.2017.11.042

Cited by 39 publications

(17 citation statements)

References 28 publications

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“…W: Recent progress in Cu-W synthesis and mechanical testing has found satisfactory mechanical properties [98][99][100][101][102]. The Cu-W alloys are usually obtained by MA due to huge difference in melting point between elements.…”

Section: Stacking Fault Energies In Copper In 5d Transition Metal Alloysmentioning

confidence: 99%

Generalised stacking fault energies of copper alloys - density functional theory calculations

Muzyk

Kurzydłowski

2019

J min metall B Metall

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Generalised stacking fault energies of copper alloys have been calculated using density functional theory. Stacking fault energy of copper alloys is correlated with the d-electrons number of transition metal alloying element. The tendency to twiningis also modified by the presence of alloying element in the deformation plane. The results suggest that Cu-transition metal alloys with such elements as Cr, Mo, W, Mn, Re are expected to exhibit great work hardening rate due to the tendency to emission of the partial dislocations.

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Section: Stacking Fault Energies In Copper In 5d Transition Metal Alloysmentioning

confidence: 99%

Generalised stacking fault energies of copper alloys - density functional theory calculations

Muzyk

Kurzydłowski

2019

J min metall B Metall

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“…However, W–Cu composites prepared by liquid-phase sintering or infiltration exhibit inferior compositional uniformity and an undesirable contradiction between density and grain size due to the significant difference in melting points of W and Cu [ 4 , 5 ]. It has been reported that the reduction in the size of W particles or the addition of a small amount of nano-W powder can improve the hardness and conductivity of W–Cu composites [ 6 , 7 , 8 ].…”

Section: Introductionmentioning

confidence: 99%

Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W–Cu Composite Coatings

Zhao

Zhuo

et al. 2021

Materials

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Tungsten-copper (W–Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W–Cu composites. Herein, W–Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W–Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density (J) of 2 A/dm2, frequency (f) of 1500 Hz, forward duty cycle (df) of 40% and reverse duty cycle (dr) of 10%, the W–Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.

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“…The results show that adding small amount of Ag will enhance the densification due to the higher wettability of Ag and W than that of Cu and W. However, there are few researches have done on the impact of Ag on the properties of WCu composites at present. 25,26) Mechanothermochemical process is a technique that combined ball mill and chemical synthesis to produce nano-scaled composite oxide powders. 27) Subsequently, coreduction of the oxide powder under reducing atmosphere generally gives rise to sub-micro WCu composite powder with higher sinterablilty compared to the above-mentioned processes.…”

Section: Introductionmentioning

confidence: 99%

Enhanced Property of W–Cu Composites by Minor Addition of Ag

Gong

et al. 2019

Mater. Trans.

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Nano-scale W20Cu (mass%) and W18Cu2Ag (mass%) composite powders were obtained by mechano-thermochemical process, followed by liquid phase sintering process from 1200 to 1300°C. The results indicate that the relative density and electrical conductivity of W18Cu2Ag composite were much superior to the W20Cu composite at all temperatures. Microstructural investigation reveals that minor addition of Ag is beneficial to the densification of WCu composite. This can be ascribed to the stronger the wettability and capillary force of liquid CuAg to W compared to that of pure Cu. Furthermore, during cooling Ag can precipitate into the voids between the W particles in W-rich area where is hard to be infiltrated by liquid Cu at high temperature, which is also beneficial to electrical conductivity.

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Densification and properties investigation of W-Cu composites prepared by electroless-plating and activated sintering

Cited by 39 publications

References 28 publications

Generalised stacking fault energies of copper alloys - density functional theory calculations

Generalised stacking fault energies of copper alloys - density functional theory calculations

Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W–Cu Composite Coatings

Enhanced Property of W–Cu Composites by Minor Addition of Ag

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