2018
DOI: 10.1016/j.jmatprotec.2018.03.023
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Dendritic coarsening model for rapid solidification of Ni-superalloy via electrospark deposition

Abstract: Control of splat thickness in an electrospark deposition (ESD) process can be used to improve the mechanical properties of deposited Inconel 718. The lower cooling rates of thicker deposition splats obtained through higher energy ESD parameters result in greater subgrain coarsening and lower microhardness. A subgrain growth model and Hall-Petch relationship are used to quantify the extent of subgrain coarsening and the influence of splat thickness on hardness, with a 4.5 times reduction in splat thickness achi… Show more

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Cited by 16 publications
(3 citation statements)
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“…The microstructure and measured composition of the as-received In625 and WC-10%Co ESD coatings are shown in Figure 4 (c-d) and (e-f), respectivelywith the hot-stamped coating morphology shown in Figure 4 (g) and (h), respectively. The ESD coating morphology and local composition was complex due to the nature of the ESD process which deposits "splats" of coating material onto the substrate surface [28]. Since the coating electrode was rotating at a high velocity during deposition, it scraped the surface of the substrate upon contact (Figure 1) mixing the Al-Si coating, the steel and the material being deposited from the electrode.…”
Section: ) (Mmentioning
confidence: 99%
“…The microstructure and measured composition of the as-received In625 and WC-10%Co ESD coatings are shown in Figure 4 (c-d) and (e-f), respectivelywith the hot-stamped coating morphology shown in Figure 4 (g) and (h), respectively. The ESD coating morphology and local composition was complex due to the nature of the ESD process which deposits "splats" of coating material onto the substrate surface [28]. Since the coating electrode was rotating at a high velocity during deposition, it scraped the surface of the substrate upon contact (Figure 1) mixing the Al-Si coating, the steel and the material being deposited from the electrode.…”
Section: ) (Mmentioning
confidence: 99%
“…The subgrain size is strongly dependent on the cooling rate, with a measured primary cell spacing ranging from 0.4 to 1.5 μm, indicating that very high cooling rates are present. [19] The morphology of the subgrain is determined by the ratio of the temperature gradient G at the solid/liquid interface to the solidification rate (interface velocity) R. The obtained cellular or cellular dendritic morphology is indicative of a G/R ratio too large to fully form secondary dendrite arms. After an aging heat treatment is applied, the RSP þ aged alloy 718 retains its subgrain microstructure (Figure 3a compared with Figure 3b) that includes the interdendritic eutectic and Laves phases at the subgrain boundaries.…”
Section: Microstructure Evolutionmentioning
confidence: 99%
“…Electrospark alloying (ESA) as a method of depositing protective coatings on metal surfaces is increasingly used both in Ukraine [4][5][6] and in the near and far abroad [7][8][9][10][11].…”
Section: Literature Reviewmentioning
confidence: 99%