We have characterized two chemical etchants for A1GaInP: hot sulfuric acid (H2SO4, at 60 and 70~ and dilute hydrochloric acid (1HClrlH20, at room temperature). Both chemicals are selective with composition, etching Ga0.sIno.sP slowly, and A10.sIn05P at the rate of several hundred A/s. When used to etch'laser structures, these etchants are anisotropic, resulting in approximate {111} sidewalls. For (A10.TGa0.3)0.sIn0.sP, a common alloy for laser cladding layers, the etching is also dependent upon carrier concentration. For example, while the H2SO4 at 60~ and the 1HCl:lH20 etch n-and un-doped material at a rapid rate, they are very much slower for the p-doped alloy. In contrast, hotter H2SO4 (T -> 70~ is not so selective with doping.