Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270)
DOI: 10.1109/test.1998.743140
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Delay test of chip I/Os using LSSD boundary scan

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Cited by 36 publications
(7 citation statements)
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“…Our technique is based on the ''I/O wrap delay'' measurement technique first described in [4] which used a precision-delayed strobe pulse generated by ATE or a proposed on-chip delay line; the strobe pulse was delivered to a capture latch with increasing delays until the captured result changed.…”
Section: Measuring I/o Delays Via Boundary Scanmentioning
confidence: 99%
“…Our technique is based on the ''I/O wrap delay'' measurement technique first described in [4] which used a precision-delayed strobe pulse generated by ATE or a proposed on-chip delay line; the strobe pulse was delivered to a capture latch with increasing delays until the captured result changed.…”
Section: Measuring I/o Delays Via Boundary Scanmentioning
confidence: 99%
“…Boundary scanning has been used to test delay defects on I/O pads at wafer or package levels [3]; however, at-speed testing by multiple system clocks has not been properly addressed.…”
Section: Related Workmentioning
confidence: 99%
“…IOs tests will push stuck-at fault coverage to 99%. Transition tests for IOs can be generated using the method in [7].…”
Section: Fault Coverage Experimentsmentioning
confidence: 99%