2008 51st Midwest Symposium on Circuits and Systems 2008
DOI: 10.1109/mwscas.2008.4616801
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Delay-insensitive asynchronous ALU for cryogenic temperature environments

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Cited by 16 publications
(7 citation statements)
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“…Some of the components designed are shown in Cryogenic testing was performed and verified the ALU in Figure 6 (b) was able to operate correctly within a temperature range of 2K to 297 K [9].…”
Section: Designed Sige Based Components and Technology Maturity Assesmentioning
confidence: 89%
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“…Some of the components designed are shown in Cryogenic testing was performed and verified the ALU in Figure 6 (b) was able to operate correctly within a temperature range of 2K to 297 K [9].…”
Section: Designed Sige Based Components and Technology Maturity Assesmentioning
confidence: 89%
“…For lunar surface exploration, electronics and systems must be able to withstand thermal cycling and 100 krad of radiation over 10 years. SiGe electronics have been tested to operate down to -230 ˚C (43 K) [9]. Also, SiGe devices have been tested to be TID tolerant to Mrads [14].…”
Section: Introductionmentioning
confidence: 99%
“…The original non-pipelined NCL 8051 ALU [9] is shown in The NCL 8051 ALU has three inputs (AL, AOS, and LOS) to choose the instruction to be executed. "AL" stands for Arithmetic/Logic and selects Arithmetic or Logic instruction type; once the instruction type is selected "AOS" (Arithmetic Operation Select) or "LOS" (Logic Operation Select) signals are used to choose the exact operation to be executed.…”
Section: Original Ncl 8051 Alumentioning
confidence: 99%
“…In addition, compared to the ALU design in [10], the throughput of the 8051 ALU in [9] cannot be easily increased because the ALU in [10] has a separate datapath for each operation that could be independently pipelined, whereas the 8051 ALU design in [9] utilizes the same C/L blocks for a variety of operations to significantly reduce area for the non-pipelined design, which makes pipelining it much more difficult . In order to properly pipeline the 8051 ALU in [9], it would need to be completely redesigned from scratch with pipelining in mind during the design, which would increase area, but significantly improve the throughput of the pipelined deign.…”
Section: Throughputmentioning
confidence: 99%
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