Delamination Growth in Ball Grid Array Electronic Package

Yeh, Meng‐Kao; Lee, In Shung

doi:10.4028/0-87849-989-x.363

Cited by 1 publication

(4 citation statements)

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“…(1) In the case of moisture absorption under 85°C/60%RH for 168 hours (JEDEC moisture level2), vapor pressure from 1.0 MPa to 2.0 MPa was expected during the solder reflow process. The vapor pressure when the PI die-attach paste is used is expected to be the highest pressure among Pt, P2 and Ft. (2) It is expected that the interface between the EME and a SR layer in the stacked BGA package is the easiest to be delaminated during the solder reflow process.…”

Section: Discussionmentioning

confidence: 99%

“…Henry's law between the surface of a package and the environment is described as Cs rface = pHPs (2) where Csurface is the moisture concentration at the surface, p is the relative humidity, H is Henry's law coefficient, and Ps is the saturated vapor pressure.…”

Section: Moisture Diffusion Analysismentioning

confidence: 99%

“…Interfacial delamination is one of the main causes of failure in the stacked BGA packages at high temperature during the solder reflow process. The crack propagation is caused by thermal stress and the internal vapor pressure during the solder reflow process [1][2][3][4]. An interfacial crack between dissimilar materials is intrinsically under the mixed-mode condition.…”

Section: Introductionmentioning

confidence: 99%

“…We must evaluate the respective mode of SIFs. Some researchers [1][2][3] performed analyses of crack growth in electronic packages using two-dimensional models. However, few analyses of the cracks in electronic packages based on the three-dimensional model were reported [4].…”

Section: Introductionmentioning

confidence: 99%

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Reliability of stacked ball grid array packages during the solder reflow process

Hamada

Ikeda

Miyazaki

et al. 2006

2006 International Conference on Electronic Materials and Packaging

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The reliability of a stacked ball grid array (stacked BGA) package during the solder reflow process was examined using the finite element method (FEM). The stress intensity factors (SIFs) at an interfacial crack tip in the stacked BGA package were analyzed. Vapor pressure on the surfaces of an initial crack and thermal stress were considered. The vapor pressure during the solder reflow was estimated by moisture diffusion analysis. Initial cracks were assumed along interfaces between the die-attach paste/film and a solder resist (SR) layer, the epoxy molding encapsulant (EME) and a SR layer, and a cupper layer and a SR layer. The SIFs of these interfacial cracks were compared with the fracture toughnesses of respective interfaces. The effect of the sizes of the initial cracks on the SIFs was investigated. To measure the fracture toughnesses of the respective interfaces, we performed delamination tests. Finally, the crack extension was estimated by comparing the SIFs of each interfacial crack to its fracture toughness. In this study, we clarified that cracks tend to extend on the interface between the EME and a SR layer, and that vapor pressure during the solder reflow process significantly influences the crack propagation.

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Section: Discussionmentioning

confidence: 99%

Section: Moisture Diffusion Analysismentioning

confidence: 99%