Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics

Kang, Min-Soo; Jeon, Yong-Sung; Kim, Doseok; Shin, Young-Eui

doi:10.1007/s12541-016-0055-3

Cited by 14 publications

(6 citation statements)

References 19 publications

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“…From the results of the thermal shock simulations, it can be seen that the maximum stress point was at the contact area between the cover layer and Cu external electrode. When the CTE of the BaTiO3 material was set as 3.1E-06, the stress generated increased when the difference in CTE between the Ni internal electrode and Cu external electrode increased [18,19]. However, at 1.51E-05, where the difference in CTE between the Ni and Cu materials was the smallest, the maximum stress increased again.…”

Section: Thermal Shock Test According To Cte and Specific Heat Change Of Mlccmentioning

confidence: 99%

“…Table 4 shows the three-point bending test displacement conditions and thermal shock test temperature range. According to the AEC-Q200 standard, the board flex test was expected to apply a displacement of 2 mm for 5 s [10][11][12] and the thermal shock test had to endure 500 cycles, maintained for 30 min at each temperature point in the range of − 55 to 125 °C [13,14]. Figure 2 is a graph of the temperature cycle used in the analysis.…”

Section: Analysis Parametersmentioning

confidence: 99%

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Design and FEM Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance

Lee¹,

Yoon²

2021

J. Electr. Eng. Technol.

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This study presents a finite-element-method analysis of the bending and thermal shock crack performance of multilayer ceramic capacitors (MLCCs) used in automobiles. The stress, strain, and heat flux values were analyzed for different MLCC structures and material parameters using three-point bending test and thermal shock test simulations. Three-dimensional modeling was performed using the actual design values of an MLCC-1005 size and 1 µF capacitance-and simulations were performed after setting the boundary and analysis conditions for the three-point bending and thermal shock tests. Based on the analyzed simulation results, the stress, strain, and heat flux values applicable to the MLCC were compared and analyzed to determine the optimum modeling parameters that could improve its reliability under harsh environmental conditions. This study was able to confirm the structural stress and strain changes, and the results were found to be useful to optimize the design of automotive MLCC devices. KeywordsFinite element method • Heat flux • Multilayer ceramic capacitor • Strain • Stress • Thermal shock • Three-point bending * Jung-Rag Yoon

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Section: Thermal Shock Test According To Cte and Specific Heat Change Of Mlccmentioning

confidence: 99%

Section: Analysis Parametersmentioning

confidence: 99%

Design and FEM Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance

Lee¹,

Yoon²

2021

J. Electr. Eng. Technol.

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“…Terdapat pelbagai jenis ujian berdasarkan piawai yang dijalankan bagi menentukan kebolehharapan sambungan pateri. Antaranya seperti ujian kejutan terma (Kang et al 2016), ujian periuk tekanan (PCT) (Zhang & Paik 2016), ujian getaran (Che & Pang 2015), ujian kitaran terma (TC) (Kwon et al 2016) dan ujian penyimpanan suhu tinggi (HTS) Mustafa et al 2016). Kajian kesan gelombang kejutan terhadap sambungan pateri adalah sangat penting untuk mengetahui kebolehharapan dan kebolehtahanan peralatan elektronik yang digunakan oleh tentera ketika peperangan.…”

Section: Pengenalanunclassified

Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano

Bakar¹,

Jalar²,

Yusoff³

et al. 2019

JSM

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Kebolehharapan dan kebolehtahanan pempakejan elektronik bagi peralatan elektronik dalam bidang ketenteraan adalah menjangkaui kepenggunaan komersial. Kebolehharapan sambungan pateri merupakan perkara asas bagi penilaian prestasi pempakejan elektronik. Ujian kebolehharapan komersial atau konvensional seperti dalam standard JEDEC (Solid State Technology Association) tidak dapat memenuhi keperluan pempakejan elektronik untuk piawaian ketenteraan. Kajian ini melaporkan gerak balas sambungan logam pateri SAC 0307 pada papan litar bercetak (PCB) dengan kemasan permukaan electroless nickel immersion gold (ENiG) terhadap gelombang kejutan hasil daripada ujian letupan secara terbuka. Perubahan sifat mikromekanik dikaji menggunakan pendekatan pelekukan nano. Gelombang kejutan yang berbeza dikenakan pada sambungan pateri dengan menggunakan bahan Emulex dengan dos sebanyak 700 g dan 1500 g. Kekerasan sambungan pateri telah menyusut sebanyak 29% daripada 141 MPa kepada 100 MPa selepas didedahkan pada gelombang kejutan dengan penggunaan dos Emulex sebanyak 1500 g. Modulus terkurang sambungan pateri juga telah menyusut sebanyak 13% daripada 141 GPa kepada 123 GPa dengan penggunaan dos bahan Emulex sebanyak 1500 g. Ujian gelombang kejutan telah menyebabkan berlakunya perubahan pada sifat mikromekanik sambungan pateri iaitu berlakunya kelakuan perlembutan yang melibatkan penyusutan nilai kekerasan dan modulus terkurang. Tiada retak diperhatikan pada antara sambungan pateri-substrat yang menunjukkan bahawa sambungan pateri adalah tidak gagal dan tetap utuh selepas didedahkan pada gelombang kejutan yang tinggi, walaupun berlaku penyusutan sifat mikromekanik yang ketara.

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“…Recently, the joints failure caused by the thermal-mechanical stress has become a serious reliability issue in advanced packages (Coyle et al, 2015). Many studies have focused on the thermal-mechanical failure of solder joints and suggested that it is strongly related to microstructure evolutions of solder joints mainly including the excessive IMCs growth and solder grains recrystallization (Kang et al, 2016;Shen et al, 2014;Hokka et al, 2013). Some of them evaluated influences of IMCs microstructure evolutions on the joints failure, such as the interfacial IMCs growth, IMCs coarsening inside the solder matrix, IMC morphologies, as well as IMCs type.…”

Section: Introductionmentioning

confidence: 99%

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Tian

Fang

Ren

et al. 2020

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Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests. Design/methodology/approach This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper (Cu) pads. After assembly, the samples were subjected to air-to-air thermal shock testing from 55 to 125 per cent. The transfer time was less than 5 s, and the dwell time at each temperature extreme was 15 min. To investigate the microstructure evolution and crack growth, two samples were removed from the thermal shock chamber at 0, 400, 1,200, 2,000, 5,800 and 7,000 cycles. Findings The results showed that one (Cu, Ni)6Sn5/(Ni, Cu)3Sn4 dual-layer structure formed at the Ni pad interface of chip side dominates the micro-joints failure. This is because substantial (Ni, Cu)3Sn4 grain boundaries provide a preferential pathway for the catastrophic crack growth. Other IMCs microstructure evolutions that cause the prevalent joints failure as previously reported, i.e. thickened interfacial (Cu, Ni)6Sn5 and Ni3P layer, and coarsened IMCs inside the solder matrix, only contributed to the occurrence of fine cracks. Moreover, the typical interfacial IMCs spalling triggered by thermally induced stress did not take place in this study, showing a positive impact in the micro-joint reliability. Originality/value As sustained trends toward multi-functionality and miniaturization of microelectronic devices, the joints size is required to be constantly scaled down in advanced packages. This arises a fact that the reliability of small-size joints is more sensitive to the IMCs because of their high volume proportion and greatly complicated microstructure evolutions. This paper evaluated precise correlations between IMCs microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using TS tests. It found that one (Cu, Ni)6Sn5/(Ni, Cu)3Sn4 dual-layer structure formed at the Ni pad interface dominate the micro-joints failure, whereas other IMCs microstructure evolutions that cause the prevalent joints failure exhibited nearly negligible effects.

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Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics

Cited by 14 publications

References 19 publications

Design and FEM Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance

Design and FEM Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance

Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

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