Deformation of solder joint under current stressing and numerical simulation––I

Ye, Hua; Basaran, Cemal; Hopkins, Douglas C.

doi:10.1016/j.ijsolstr.2004.04.002

Cited by 35 publications

(14 citation statements)

References 23 publications

(17 reference statements)

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“…Ye et al [68,69] measured the in situ displacement evolution of lead-free solder joints under electric current stressing. Stellrecht et al [70,71] developed an effective scheme to measure deformations induced only by hygroscopic swelling.…”

Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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Moiré interferometry has been a valuable experimental technique for the understanding of the mechanical behavior of materials and structures. Over the last decade less emphasis has been placed on the development of the technique and more towards applications. This paper is a review article on recent applications using moiré interferometry in the fields of microelectronics devices, material characterization, micromechanics, residual stress, composite materials, fracture mechanics, and biomechanics. The general principles of moiré interferometry and advancement of techniques will not be discussed in this text, but references will be provided.

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Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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“…It has been considered that the elevated operating temperature may affect the evolution process of the eutectic solder joint. Generally, the effect of a high operating temperature on the eutectic solder has been investigated by increased atomic diffusivity that would accelerate the evolution process [5], or by the additional strain due to thermal expansion [7]. However, the melting point of the lead-free solder that is considered in this paper is around 218 ℃.…”

Section: Modelmentioning

confidence: 99%

“…This melting point is much higher than that of a typical eutectic solder, which is around 180 ℃. Moreover, an improved thermal management that led to the solder joint without much heat generation even with very high current density, which was around 10 4 A/cm 2 , was developed in experiments [7]. Furthermore, there is an experimental study which indicates that the electric current has a greater influence on even the eutectic solder joint than temperature [8].…”

Section: Modelmentioning

confidence: 99%

Three-dimensional model for electromigration induced evolution of flip chip solder joints

Kim

2009

J Mech Sci Technol

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Recent experiments have shown failure in flip chip micro solder joints induced by electromigration. This paper proposes a computational model to simulate the evolution of micro and sub-micro scale solder joints due to electromigration induced diffusion. Complicated morphological changes of the solder bump and multiple mechanisms cause a computational challenge. This is addressed by employing a diffuse interface model with multiple concentrations. To efficiently resolve complications, a semi-implicit Fourier spectral scheme and a biconjugate-gradient method are adopted. Results have demonstrated rich dynamics and solder breakage at the interface on the cathode side.

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“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] BasaranÕs group studied stress and deformation in solder joints under high current stressing. [21][22][23][24][25][26] This study examined thermomechanical stress and strain in the different solder joints during steady-state electromigration.…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical Stress and Strain in Solder Joints During Electromigration

Zhang

et al. 2009

Journal of Elec Materi

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Thermomechanical stress and strain in the solder joints of a dummy area array package were studied as electromigration occurred. A current density of 0.4 9 10 4 A/cm 2 was applied to this package, constructed with 9 9 9 solder joints in a daisy chain, to perform the electromigration test. After 37 h, the first joint on the path of the electron flow broke off at the cathode, and the first three solder joints all exhibited a typical accumulation of intermetallic compounds at the anode. Different solder joints exhibited dissimilar electromigration states, such as steady state and nonsteady state. Finite element analysis indicated that during steady-state electromigration, although the symmetrical structure produced uniform distributions of current density and Joule heating in all solder joints, the distribution of temperature was nonuniform. This was due to the imbalanced heat dissipation, which in turn affected the distribution of thermomechanical stress and strain in the solder joints. The maximum thermomechanical stress and strain, as well the highest temperature and current crowding, appeared in the Ni/Cu layer of each joint. The strain in the Ni/Cu layer was significant along the z-axis, but was constrained in the x-y plane. The thermomechanical stress and strain increased with advancing electromigration; thus, a potential delamination between the Ni/Cu layer and the printed circuit board could occur.

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Deformation of solder joint under current stressing and numerical simulation––I

Cited by 35 publications

References 23 publications

Recent Applications of Moiré Interferometry

Recent Applications of Moiré Interferometry

Three-dimensional model for electromigration induced evolution of flip chip solder joints

Thermomechanical Stress and Strain in Solder Joints During Electromigration

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