Deformation behavior of thin copper films on deformable substrates

Geometrically necessary dislocations and strain-gradient plasticity: a few critical issues

“…As a consequence, the scale-dependent increment in yield stress depends linearly on (1=d), or more correctly on (lnðdÞ=d). For instance, in the deformation of polycrystalline copper thin films on a substrate [15], the yield stress scales as 1=d due to confinement, whereas the strain hardening behavior does not and may be qualitatively understood in terms of GND storage. Confinement size effects are also currently observed in lamellar materials and in superalloys with large volume fractions of the hard phase, where the width of the ductile channels is about 0.1 lm.…”

On the analysis of the stress–strain behaviour of thin metal films on substrates using nanoindentation

“…9). It can be argued, however, that this is not a "direct" thin film effect, which has been subject of previous work [3,[19][20][21][22][23], in which thin metal films with columnar grain structure were investigated (for a review see Ref.…”

“…This problem can be overcome by using by X-ray diffraction during tensile tests as originally suggested by Schadler and Noyan [2]. Hommel and Kraft [3] have adapted this technique to investigate the deformation behaviour of Cu thin films on compliant substrates as a function of film thickness, grain size and texture. It was found that with decreasing film thickness and/or grain size the yield strength of the film as well as the hardening coefficient increases.…”

Strain-Induced Reverse Phase Transformation in Nanocrystalline Co-Ni Alloys

“…However, the soft substrates can stabilize the specimens and avoid strain localization during tensile tests. [26][27][28] As the samples were tested together with the 304 stainless steel substrates, ductility is not only a function of the film microstructure, but is also dependent on the overall adhesion of the substrate. Figure 3 shows the typical tensile engineering stress-strain curve for the free-standing sample (curve a) in comparison with that for the sample together with the substrate (curve b) and the 304 stainless steel substrate (curve c) under a tensile rate of 0.5 mm/min.…”