Deformation and Failure Behaviour of Horseshoe-Shaped Interconnect Encapsulated on Functionally Graded Pdms Stretchable Substrates

Patidar, Deepesh; PAL, VIJAY Kumar

doi:10.2139/ssrn.4384167

2023

DOI: 10.2139/ssrn.4384167

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Deformation and Failure Behaviour of Horseshoe-Shaped Interconnect Encapsulated on Functionally Graded Pdms Stretchable Substrates

Deepesh Patidar¹,

VIJAY Kumar PAL²

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Deformation and Failure Behaviour of Horseshoe-Shaped Interconnect Encapsulated on Functionally Graded Pdms Stretchable Substrates

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