2001
DOI: 10.1016/s0022-0248(01)01266-0
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Defect reduction in GaN epilayers and HFET structures grown on (0001)sapphire by ammonia MBE

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Cited by 29 publications
(16 citation statements)
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“…24 Historically, in the authors' laboratory, a growth regime using a high temperature ͑840-880°C͒ just below the GaN thermal decomposition threshold point and a moderate ammonia flux ͑100 SCCM, BEP= 5 ϫ 10 −5 Torr͒ has been established and applied for GaN high-electron-mobility transistors ͑HEMT͒ devices on sapphire and SiC substrates. 25,26 In this growth regime, the growth is via a three-dimensional ͑3D͒ mode, yielding facetted surface morphology but also large grain size, low defect density, and high electron mobility, mainly due to the higher growth temperature used. 25 Unintentionally doped GaN grown in this regime is always n-type conducting.…”
Section: Ammonia Cracking Kinetics and Growth Regimesmentioning
confidence: 99%
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“…24 Historically, in the authors' laboratory, a growth regime using a high temperature ͑840-880°C͒ just below the GaN thermal decomposition threshold point and a moderate ammonia flux ͑100 SCCM, BEP= 5 ϫ 10 −5 Torr͒ has been established and applied for GaN high-electron-mobility transistors ͑HEMT͒ devices on sapphire and SiC substrates. 25,26 In this growth regime, the growth is via a three-dimensional ͑3D͒ mode, yielding facetted surface morphology but also large grain size, low defect density, and high electron mobility, mainly due to the higher growth temperature used. 25 Unintentionally doped GaN grown in this regime is always n-type conducting.…”
Section: Ammonia Cracking Kinetics and Growth Regimesmentioning
confidence: 99%
“…25,26 In this growth regime, the growth is via a three-dimensional ͑3D͒ mode, yielding facetted surface morphology but also large grain size, low defect density, and high electron mobility, mainly due to the higher growth temperature used. 25 Unintentionally doped GaN grown in this regime is always n-type conducting. As a solution, we developed a carbon doping method using a low energy methane ion source, which successfully compensates all residual donors and yields semi-insulating GaN materials required for the HEMT devices.…”
Section: Ammonia Cracking Kinetics and Growth Regimesmentioning
confidence: 99%
“…However, the grain size increases with the increasing growth temperature. Previous studies on sapphire substrates have shown that under the 3-D growth conditions, the increase in grain size correlates with reduction in threading dislocations and increase in bulk electron mobility [9]. The SiC substrates used for the samples in Fig.…”
Section: Plain Growth Without Strain Relief Buffermentioning
confidence: 99%
“…Плотность дислокаций в GaN, выращенных методом МОГФЭ, находится в диапазоне 10 8 −10 9 см −2 (10 7 см −2 с использованием технологии ELOG), в то же время для МЛЭ это значение находится в диапазоне 10 9 −10 10 см −2 , что приводит к меньшим значениям подвижности в GaN, выращенном МЛЭ, по сравнению с МОГФЭ. Типичные значения подвижно-сти электронов в слоях GaN, выращенных методом МЛЭ на сапфире или SiC с использованием различ-ных буферных слоев (обычно GaN, AlGaN или AlN толщиной менее 50 нм), составляют 250−350 см 2 /В · с, а для МОГФЭ -500−700 см 2 /В · с. Рекордные значения составляют 560 см 2 /В · с (с использованием буферного слоя AlN, полученного при помощи магнетронного распыления) и 900 см 2 /В · с для МЛЭ и МОГФЭ со-ответственно [1,2]. Путем оптимизации условий МЛЭ роста в слоях GaN, выращенных МОГФЭ " темплейтах", были получены значения подвижности электронов бо-лее 1100 см 2 /В · с [3].…”
Section: Introductionunclassified