2020
DOI: 10.4028/www.scientific.net/ssp.305.147
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Defect Reduction in Forming Process of Fired Clay Floor Tiles by Six Sigma Approach

Abstract: The objective of this research was to reduce defects in the forming process of fired clay floor tiles by modifying the parameter settings of the influential factors using the Six Sigma approach. The current process had 152,871.16 DPPM (Defect Parts per Million). The main cause of this problem was the rough surface problem in the forming process. The five steps of the Six Sigma quality improvement approach were exercised in this research, i.e. define, measurement, analysis, improvement, and control phases, resp… Show more

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Cited by 6 publications
(3 citation statements)
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“…The production processes of the company case study were assessed and optimized using six sigma tools such as a process flow chart, a Pareto chart, a Cause and Effect Diagram, and analysis. Following that, the Design of Experiment (DOE) technique was used to determine the parameters for each factor [11]. Minitab19 is the program that is utilized to conduct the research.…”
Section: Methodsmentioning
confidence: 99%
“…The production processes of the company case study were assessed and optimized using six sigma tools such as a process flow chart, a Pareto chart, a Cause and Effect Diagram, and analysis. Following that, the Design of Experiment (DOE) technique was used to determine the parameters for each factor [11]. Minitab19 is the program that is utilized to conduct the research.…”
Section: Methodsmentioning
confidence: 99%
“…There are three operators are responsible for T.Al measurement. To ensure all three operator's performance, the test was done with 2 replicates and 5 samples [3,4]. The test result was shown in Table 2.…”
Section: Measure Phasementioning
confidence: 99%
“…According to the research studying the method to reduce defect rates in various manufacturing process e.g. PET film peeled off in-mould decoration (IMD) [2], the rough surface problem in the forming process of fired clay [3], and die crack in integrated circuit production [4], all apply 5 steps of the Six Sigma methodology which are described in following; Define the problem and its impact, Measurement process performance and analyse measurement system, Analyse cause of poor performance, Improve process performance and control the improved process [5]. Based on their result show that the defect rates a significant decrease.…”
Section: Introductionmentioning
confidence: 99%