2015
DOI: 10.4028/www.scientific.net/msf.821-823.193
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Defect Reduction in Epitaxial 3C-SiC on Si(001) and Si(111) by Deep Substrate Patterning

Abstract: The heteroepitaxial growth of 3C-SiC on Si (001) and Si (111) substrates deeply patterned at a micron scale by low-pressure chemical vapor deposition is shown to lead to space-filling isolated structures resulting from a mechanism of self-limitation of lateral expansion. Stacking fault densities and wafer bowing may be drastically reduced for optimized pattern geometries.

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Cited by 14 publications
(9 citation statements)
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“…Specific patterning of Si substrate has been proposed in order to further decrease the amount of extended defects. [9][10][11][12][13] Lower SF densities are observed at the surface of 3C-SiC layers grown on undulate, [14] pyramidal-shape, [15,16] and pillar-shape patterned substrates. [9,10] At this, however, the desired defect level for device performance (10 2 cm −1 ) has not been reached so far.…”
Section: Introductionmentioning
confidence: 99%
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“…Specific patterning of Si substrate has been proposed in order to further decrease the amount of extended defects. [9][10][11][12][13] Lower SF densities are observed at the surface of 3C-SiC layers grown on undulate, [14] pyramidal-shape, [15,16] and pillar-shape patterned substrates. [9,10] At this, however, the desired defect level for device performance (10 2 cm −1 ) has not been reached so far.…”
Section: Introductionmentioning
confidence: 99%
“…[9][10][11][12][13] Lower SF densities are observed at the surface of 3C-SiC layers grown on undulate, [14] pyramidal-shape, [15,16] and pillar-shape patterned substrates. [9,10] At this, however, the desired defect level for device performance (10 2 cm −1 ) has not been reached so far. [17][18][19] The effectiveness of growing techniques and their optimization strictly depend on the understanding of the evolution mechanisms of SFs and terminating them partial dislocations during deposition.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The method has been successfully applied to several heteroepitaxial systems such as Ge/Si [11,12,13], GaAs/Si [14,15], GaAs/Ge/Si [16] and GaN/Si [17]. It has already been demonstrated also for 3C-SiC/Si in References [9,18], with beneficial effects on the crystal quality [18] and a substantial decrease in defectivity [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…In order to achieve a smooth morphology, without holes and irregularities, surface diffusion has to be active [23] thus requiring the growth to be performed at high-temperature. Growth of 3C-SiC suspended layers, arranged into patches as large as hundreds of micrometers, was reported in References [8,19]. The reduced bowing made possible by the pillar architecture allowed for the growth of thick (up to 20 μm), single-crystal 3C-SiC layers with a significant reduction in stacking faults density compared to the case of unpatterned substrates [9].…”
Section: Introductionmentioning
confidence: 99%