Decoration of defect-free graphene nanoplatelets with alumina for thermally conductive and electrically insulating epoxy composites

Sun, Renhui; Younan, Hua; Zhang, Haobin; Li, Yue; Mai, Yiu‐Wing; Yu, Zhong‐Zhen

doi:10.1016/j.compscitech.2016.10.017

Cited by 117 publications

(39 citation statements)

References 39 publications

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“…This may be due to high surface area generation and oxide functionalization of EG which avoids agglomeration of GNP layers and decreases the filler/filler interface resistances inside the epoxy matrix. This is also in accordance with reference papers [13,[17][18][19][20][21]. Further, incorporating hybrid fillers in increasing order up to 10 wt.%, 25 wt.%, 35 wt.% filler fraction, the thermal conductivity of EG// GNP epoxy composites were increased linearly (Fig.…”

Section: Thermal Conductivity (K)supporting

confidence: 91%

“…2, we can write that Thermal conductivity test of different epoxy composite samples was determined to analyze the thermal conductivity (TC) enhancement at different single and hybrid filler loading level inside the epoxy resin. It has been proved by different authors literature work that the TC of composites based on GNPs is generally enhanced between 5 and 15 wt.% loading percentage and higher loading of GNPs decreases the optimal properties of composites [11,13,18]. It has also been proved that TC of EG-based composites increased between 5 and 25 wt.% loading and lesser number of scientific literature work provide TC data above 25 wt.% filler loading level.…”

Section: Thermal Conductivity (K)mentioning

confidence: 94%

“…This is in accordance with the Baruch et al, Kemaloglu et al and Mahanta et al They said that the aspect ratio of the filler plays important role in thermal conductivity enhancement of composite systems. A synergistic effect between the graphite nanoplatelets (GNPs) and SWCNTs in the enhancement of the thermal conductivity of epoxy composites was reported by Yu et al and described to the formation of a more efficient percolating hybrid CNT/GNP network with significantly reduced thermal contact resistance [13,22].…”

Section: Thermal Conductivity (K)mentioning

confidence: 98%

“…Silane functionalization of GNPs is required at a high concentration of GNP inside reinforced polymer composite to increase the interaction of GNP with polymeric chains and avoid agglomerations. Functionalization increases the mechanical strength and thermal properties, but it also generates extra interface resistances which may decrease TC due to phonon scattering at different generated interfaces [13,14]. So the best way to increase TC of GNP-based composites is to coat or hybridize with equivalent filler having (nearly same inherent TC) which can avoid agglomeration and excess adhesion [15,16].…”

Section: Introductionmentioning

confidence: 99%

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Study on epoxy resin-based thermal adhesive filled with hybrid expanded graphite and graphene nanoplatelet

2019

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Reinforced epoxy composite adhesives of expanded graphite (EG) and graphene nanoplatelet (GNPs) were prepared by hand layup and mechanical mixing method. Disk-shaped epoxy composite samples with EG and GNP mixtures in varying ratios were prepared to measure the thermal conductivity (TC) enhancement. Thermal characterization testing data showed high thermal conductivity enhancement with three different hybrid filler concentrations of 10, 25, and 35 wt%, respectively. The highest thermal conductivity of 3.6 W/m K was obtained for an epoxy adhesive composite having 30 wt.% EG and 5 wt.% GNP which was tested by guarded heat flow meter technique. This significant improvement in thermal conductivity can be attributed to the lowering of overall thermal interface resistance due to small amounts of nanofiller (GNP) improving the thermal contact between the primary microfillers (graphite). The synergistic effect of this hybrid filler system is lost at higher loadings of the GNP relative to expanded graphite. The structure of the graphite flake, GNP/epoxy, EG/epoxy and hybrid EG/GNP/epoxy composites was investigated by XRD. The EG prepared by acid intercalation and abrupt thermal expansion showed good compatibility with GNP and the epoxy resin. From scanning electron microscopy photographs, the formation of conducting network observed through the expanded graphite and GNPs in a low conducting epoxy matrix. The thermal decomposition temperature of the composite increased to 450 and 615 °C with the addition of 10 and 35 wt% of hybrid EG/GNP inside epoxy matrix, respectively. LAP shear strength of single and hybrid filled epoxy adhesive decreased at 35 wt.% loading than neat epoxy.

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Section: Thermal Conductivity (K)supporting

confidence: 91%

Section: Thermal Conductivity (K)mentioning

confidence: 94%

Section: Thermal Conductivity (K)mentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

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Study on epoxy resin-based thermal adhesive filled with hybrid expanded graphite and graphene nanoplatelet

2019

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“…Although the electrical conductivity of metallic fillers could be somewhat tailored by oxidation or surface treatment [80,81], the high thermally conductive ceramic fillers is more preferable for not only their electrical insulation property but also thermal stabilities. Typical high thermal conductivity ceramic nano-fillers are magnesium oxide (MgO) [82][83][84], aluminum oxide (Al2O3) [85][86][87][88], silicon nitride (Si3N4) [89][90][91], silicon carbide (SiC) [92][93][94], zinc oxide (ZnO) 21 [95], aluminum nitride (AlN) [96][97][98][99], and boron nitride (BN) [100][101][102][103][104]. Compared with the metallic and ceramic fillers, nanostructured carbon fillers have attracted more intensive interests because of their high thermal conductivity.…”

Section: Thermal Conductivity Of Polymer Nanocompositesmentioning

confidence: 99%

Thermal conductivity of polymers and polymer nanocomposites

Huang

Qian

Yang

2018

Materials Science and Engineering: R: Reports

640

391

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Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In this review article, we aim to: 1). systematically summarize the molecular level understanding on the thermal transport mechanisms in polymers in terms of polymer morphology, chain structure and inter-chain coupling; 2). highlight the rationales in the recent efforts in enhancing the thermal conductivity of nanostructured polymers and polymer nanocomposites. Finally, we outline the main advances, challenges and outlooks for highly thermal-conductive polymer and polymer nanocomposites. the inter-chain coupling. Fig. 1 Schematic diagrams of a polymer: (a) the morphology of a polymer consisting of crystalline and amorphous domains; (b) structure of a polymer chain.In addition to engineering the morphology of polymer chains, another common method to enhance the thermal conductivity of polymers is to blend polymers with highly thermal conductive fillers. The progress of nanotechnology over the last two decades not only provides more diverse high thermal conductivity fillers of different material types and topological shapes but also advances the understanding at the nanoscale. Fig. 2 shows a sketch of a polymer nanocomposite to illustrate the thermal transport mechanisms. In general, there are two types of polymer nanocomposites depending on whether nano-fillers form a network or not. When the filler concentration is low, no inter-filler networks could be formed, as shown in Fig. 2(a). The thermal conductivity is essentially determined by the filler-matrix coupling, i.e, interfacial thermal resistance, and the concentration and the geometric shapes of fillers. When the filler concentration is large enough, high conductivity fillers might form thermally conductive networks, as shown in Fig. 2(b). Although nanocomposites with filler network could possess a higher thermal conductivity than that without a network, their thermal conductivity could still be low due to the large inter-filler thermal contact resistance. Recently, three-dimensional fillers, such as carbon and graphene foams, have drawn a lot of attention. The fundamental thermal transport mechanisms and recent synthesis efforts in both types of nanocomposites are reviewed.This review article is organized as follows. In Section 2, we introduce the experimental progress on the enhancement of thermal conductivity by aligning polymer chains, and then review the methods to further tune the thermal conductivity by engineering chain structure and inter-chain coupling, as illustrated in Fig. 3(a). In Section 3, we discuss the thermal conductivity of polymer nanocomposites both with and without inter...

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Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Barani

Mohammadzadeh

Geremew

et al. 2019

Adv Funct Materials

218

160

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The thermal properties of epoxy‐based binary composites comprised of graphene and copper nanoparticles are reported. It is found that the “synergistic” filler effect, revealed as a strong enhancement of the thermal conductivity of composites with the size‐dissimilar fillers, has a well‐defined filler loading threshold. The thermal conductivity of composites with a moderate graphene concentration of fg = 15 wt% exhibits an abrupt increase as the loading of copper nanoparticles approaches fCu ≈ 40 wt%, followed by saturation. The effect is attributed to intercalation of spherical copper nanoparticles between the large graphene flakes, resulting in formation of the highly thermally conductive percolation network. In contrast, in composites with a high graphene concentration, fg = 40 wt%, the thermal conductivity increases linearly with addition of copper nanoparticles. A thermal conductivity of 13.5 ± 1.6 Wm−1K−1 is achieved in composites with binary fillers of fg = 40 wt% and fCu = 35 wt%. It has also been demonstrated that the thermal percolation can occur prior to electrical percolation even in composites with electrically conductive fillers. The obtained results shed light on the interaction between graphene fillers and copper nanoparticles in the composites and demonstrate potential of such hybrid epoxy composites for practical applications in thermal interface materials and adhesives.

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Decoration of defect-free graphene nanoplatelets with alumina for thermally conductive and electrically insulating epoxy composites

Cited by 117 publications

References 39 publications

Study on epoxy resin-based thermal adhesive filled with hybrid expanded graphite and graphene nanoplatelet

Study on epoxy resin-based thermal adhesive filled with hybrid expanded graphite and graphene nanoplatelet

Thermal conductivity of polymers and polymer nanocomposites

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

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