DC vacuum arc deposition with open winding-path anode assembled with C-ring plates

Abstract

Vacuum arc deposition (VAD), which utilizes the vapored high energy metal ions from an electrode, is widely used in industry. Though VAD have many advantages, reduction of droplets on deposited films is an essential issue to solve for industrial application. In this study, we have developed a new type of filtered arc deposition (FAD) utilizing a winding coil with copper C-ring-shaped plates in vacuum chamber. TiN films were deposited on substrates with a normal linear FAD and the new FAD. TiN films were analyzed, and it was found that the number of droplets were significantly reduced with the new FAD.