Nano Plating - Microstructure Formation Theory of Plated Films and a Database of Plated Films 2004
DOI: 10.1016/b978-008044375-1/50016-6
|View full text |Cite
|
Sign up to set email alerts
|

Database for the Microstructure of Plated Films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
8
0

Year Published

2010
2010
2017
2017

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 6 publications
(8 citation statements)
references
References 165 publications
0
8
0
Order By: Relevance
“…Solution stability can be also directly reflected via the surface irregularities or nodules. 14 The nodule, a semi-spherical protrusion appearing on the surface of plated films, are usually connected to the pre-existing etched surface irregularities or flow rate of solution. 14 Figure 4 shows the surface morphologies of Ni–P films deposited at bath pH values of 5, 6, 7, 8 and 9.…”
Section: Resultsmentioning
confidence: 99%
“…Solution stability can be also directly reflected via the surface irregularities or nodules. 14 The nodule, a semi-spherical protrusion appearing on the surface of plated films, are usually connected to the pre-existing etched surface irregularities or flow rate of solution. 14 Figure 4 shows the surface morphologies of Ni–P films deposited at bath pH values of 5, 6, 7, 8 and 9.…”
Section: Resultsmentioning
confidence: 99%
“…In basic media, the half-cell reaction for oxygen evolution at the anode electrode is described by eq Ni and Co (hydr)­oxide films have been prepared by sol–gel, thermal decomposition, solution casting, electrodeposition and other methods. The overall composition, Co or Ni content, thickness, morphology and the way the films are attached to the electrodes are a function of the preparation methods, and determine the activity and stability of the catalysts. Generally, it is easier to control the film thickness and particle size by electrodeposition . CoO x films formed by oxidative electrodeposition from Co II solution in the presence of inorganic phosphate, borate, and other buffered electrolytes have been studied by Nocera and co-workers. Their work, together with the study by Gerken et al, have provided insights into the catalytic water oxidation mechanism using a CoO x film, and led to the proposal that the O–O bond formation step involves the reaction of water with oxo Co IV .…”
Section: Introductionmentioning
confidence: 99%
“…ENDOM is generally applicable to the preparation of metallic, semiconducting, and insulating nanostructures on many technologically relevant substrates. Dimethylamine borane (DMAB) is a versatile reducing agent that can be used to deposit metals including gold, silver, cobalt, palladium, iron, copper, alloys, semiconductors, , and insulators . ENDOM can also be employed using other Lewis acid/base or ionic reducing agents, for example, sodium borohydride, which allows even greater synthesis flexibility.…”
mentioning
confidence: 99%
“…Dimethylamine borane (DMAB) is a versatile reducing agent that can be used to deposit metals including gold, silver, cobalt, palladium, iron, copper, alloys, semiconductors, , and insulators . ENDOM can also be employed using other Lewis acid/base or ionic reducing agents, for example, sodium borohydride, which allows even greater synthesis flexibility. Well-ordered SAMs can be on most substrates, from metals to semiconductors to polymers. , Furthermore, the micropatterning of SAMs can be performed using many techniques including UV photopatterning, , electron beam lithography, , dip pen nanolithography, and microcontact printing…”
mentioning
confidence: 99%