“…Dimethylamine borane (DMAB) is a versatile reducing agent that can be used to deposit metals including gold, silver, cobalt, palladium, iron, copper, alloys, semiconductors, , and insulators . ENDOM can also be employed using other Lewis acid/base or ionic reducing agents, for example, sodium borohydride, which allows even greater synthesis flexibility. Well-ordered SAMs can be on most substrates, from metals to semiconductors to polymers. , Furthermore, the micropatterning of SAMs can be performed using many techniques including UV photopatterning, , electron beam lithography, , dip pen nanolithography, and microcontact printing…”