Data center energy efficiency enhancement potential of a membrane-assisted phase-change heat sink

Tamvada, Suhas; Moghaddam, Saeed

doi:10.1016/j.applthermaleng.2023.120556

Cited by 3 publications

(1 citation statement)

References 44 publications

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“…To further improve the performance of two-phase heat transfer, surface enhancement methods, such as porous coating [4]- [7] and micro pin-fin structures [8]- [10], have been applied to two-phase flow boiling schemes. The surface microstructures can provide a substantial amount of nucleation sites for boiling and serve as surface extensions for convective heat transfer, leading to higher heat transfer coefficients (HTC) and critical heat fluxes (CHF) than flat surfaces [11].…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling

Lyu,

Wu,

Gong

et al. 2024

IEEE Trans. Compon., Packag. Manufact. Technol.

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Section: Introductionmentioning

confidence: 99%

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling

Lyu,

Wu,

Gong

et al. 2024

IEEE Trans. Compon., Packag. Manufact. Technol.

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Enhancement Evaluation Criteria for Pool Boiling Enhancement Structures in Electronics Cooling: CHF Enhancement Ratio (Er-Chf) and Enhancement Index (Ei)

Shukla,

Kandlikar

2024

J Enh Heat Transf

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Extensive research shows the necessity of efficient cooling systems to enable electronic components to operate at high performance levels for a sustained period. While conventional methods have served the cooling needs so far, rising computational power, energy efficiency, and sustainability requirements call for improved techniques. The literature shows the effectiveness of two-phase systems in cooling electronic components like microprocessors. The literature further describes various enhancement mechanisms to elevate the critical heat flux (CHF) and heat transfer coefficient (HTC) in these systems. While a high CHF is desired, having a high HTC is equally important to keep the operating temperatures below a permissible limit. The present article summarizes enhancement structures found in the literature suitable for electronic cooling to provide this dual enhancement in CHF and HTC. New enhancement evaluation criteria that also consider the surface temperature limit imposed by the electronic components are introduced. The CHF enhancement ratio (ERCHF) represents the ratio of CHF for enhancement structures to the CHF for a plain surface, and the enhancement index (EI) represents the ratio of wall superheat at CHF with the enhanced structures to the wall superheat at its respective CHF condition for a plain surface. It is desirable to have a high value of ERCHF coupled with a low value of EI (lower the better), preferably below 1.0.

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Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling

Lyu,

Wu,

Gong

et al. 2023

Preprint

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Recently, a microporous copper inverse opals (CIO) wick material has been utilized in the thermal management of microelectronics as it significantly enhances heat transfer performance with capillary-fed boiling, providing a high critical heat flux of up to ~1100 W/cm2. In this study, we numerically investigate the thermomechanical reliability of the CIO structures with a finite element method. The mechanical stress of ordered and graded CIO structures is simulated under the conditions of external shear load and boiling-induced thermal expansion. Different geometric parameters, including pore diameter and the neck-to-pore ratio of ordered CIO, and overlap distance and pore gradient of graded CIO, have been parametrically studied. Based on the effective mechanical properties extracted with the representative volume element (RVE) method, the mechanical response of the porous structure is being further understood. The von Mises yield criterion is applied to determine the fracture of the copper structure. The reliability of ordered CIOs is assessed by evaluating the maximum von Mises stress and shear stress under the shear load, showing lower stresses with larger pore diameters and smaller pore-to-neck ratios. In contrast, a decrease in thermal stresses is found to appear in ordered CIOs with small pores and large neck-to-pore ratios under boiling conditions. The thermomechanical reliability of graded CIOs is analyzed with different pore gradients and overlap distances. The stress distribution of graded CIO structures indicates maximum stresses near the Si-Cu interface in the shear test, while the interfaces between layers of CIOs are more vulnerable under boiling conditions. In terms of the pore gradient effects, the graded CIO with a larger gradient tends to be more fragile due to the larger stresses at the interfaces between pore diameters induced by the increased differences in pore diameter.

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Data center energy efficiency enhancement potential of a membrane-assisted phase-change heat sink

Cited by 3 publications

References 44 publications

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling

Enhancement Evaluation Criteria for Pool Boiling Enhancement Structures in Electronics Cooling: CHF Enhancement Ratio (Er-Chf) and Enhancement Index (Ei)

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling

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