Damage Evaluation in Plain-Woven CFRP Plate with Circular Hole under Cyclic Tensile Loading Using Electrical Impedance Tomography

Abstract

Understanding and predicting damage progression within thin plain-woven CFRP components is an essential issue for scheduling maintenance intervals and structural inspections, and typically require extensive test series. However, uncertainties always remain and result in conservative design and unnecessary downtimes due to the repeated inspections of a healthy structure. SHM can be used to reduce these uncertainties, as it allows to evaluate the condition of a mechanical structure during operation. Numerous SHM methods are developed , that achieve different levels of damage identification but are often investigated at small coupons with non-realistic structural damages and loading conditions on both, structure and sensor. The present research investigates the electrical impedance tomography (EIT) featuring an elastoresistive thin-film sensor to evaluate damage that propagates from a circular hole in a large plate under cyclic tensile-tensile multi-block loading. Applied fatigue loads were increased multiple times up to a total number of two million cycles. During the loading damage initiated at the hole and continuously propagated into the plate. Repeated EIT evaluations of the applied sensor and validating evaluations by means of digital image correlation clearly revealed the robustness of the hardware and the potential of the SHM method for damage evaluation of plain-woven CFRP components.