Damage and Fracture of Non-metallic Materials

François, Dominique; Pineau, A.; Zaoui, A.

doi:10.1007/978-94-007-4930-6_10

Cited by 6 publications

(4 citation statements)

References 92 publications

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“…In strain-crystallization, polymer chains tend to align with each other when stress is applied to the material [63], [64]. Consequently, starting from an amorphous network of polymeric chains, crystals tend to develop (also called lamellae in polymeric material [65]- [67]). In that state, the light will then scatter at the boundaries of the lamellae crystals.…”

Section: Tssa Under Tensile Loadmentioning

confidence: 99%

Laminated connections under tensile load at different temperatures and strain rates

Santarsiero¹,

Louter²,

Nussbaumer³

2017

International Journal of Adhesion and Adhesives

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In the last years, a novel typology of adhesive connections for structural glass application has emerged, known as laminated adhesive connections, which makes use of the transparent ionomer SentryGlas® (SG) from Kuraray and the Transparent Structural Silicon Adhesive (TSSA) from Dow Corning. Despite being used in several projects, limited information is available in literature on their mechanical behaviour and on the effects of strain rate and temperature. In this work the behaviour of laminated connections under tensile loading is studied by means of experimental, analytical and numerical analyses. The experimental investigations show that temperature and strain rate variations have important effects on the mechanical response of the connections. Two main interesting phenomena are also observed: the whitening phenomenon in TSSA and the development of bubble within the SG adhesive. The analytical studies of the stress state show that confinement state of the adhesive induces a non-uniform three-dimensional stress distribution in the adhesive with a dominant hydrostatic component of the stress tensor, which is observed to be in agreement with the experimental results. Three-dimensional finite numerical analyses show that the stress field deviates from the uniform distribution with a large gradient of hydrostatic and deviatoric stresses over the adhesive area. The output of the finite numerical model are then compared with the observations of the experimental campaigns. Herein, the full set of numerical results is synthetized by the definition of socalled stress factors. The latter allow to derive the three-dimensional stress state in the adhesive at different temperatures and to compute the stress peak in the non-linear stress field distribution. Finally, prediction models are proposed for the tensile resistance of TSSA and SG laminated connections. A logarithmic law is proposed for the strain rate effects for both TSSA and SG connections. Linear and inverse hyperbolic-tangent-based laws are instead proposed for the TSSA and SG temperature effects, respectively. KeywordsLaminated adhesive connections, structural glass, experimental investigation, numerical modeling, tensile loading, strain rate effect, temperature effect -3 -

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Section: Tssa Under Tensile Loadmentioning

confidence: 99%

Laminated connections under tensile load at different temperatures and strain rates

Santarsiero¹,

Louter²,

Nussbaumer³

2017

International Journal of Adhesion and Adhesives

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“…[9] Since ductile failure mechanisms operate via the initiation, growth, and coalescence of microvoids in a plastically deforming matrix, [11][12][13] it follows that an increase in initiation site volume fraction within the matrix results in a greater number of nucleated voids and, more significantly, a reduced distance over which microvoids are able to grow under an applied triaxial stress before they coalescence with neighboring voids and fracture prevails. [14] This results in lower impact toughness since the HIP'd material falls prey to an unzipping effect, whereby closely spaced voids, initiated at oxide inclusions, grow and coalesce as the crack propagates through the ligament ahead of the notch.…”

Section: Hot Isostatic Pressing (Hip) Is a Component Man-mentioning

confidence: 99%

An Assessment of the Ductile Fracture Behavior of Hot Isostatically Pressed and Forged 304L Stainless Steel

Cooper

Smith

Sherry

2017

Metall Mater Trans A

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Type 300 austenitic stainless steel manufactured by hot isostatic pressing (HIP) has recently been shown to exhibit subtly different fracture behavior from that of equivalent graded forged steel, whereby the oxygen remaining in the component after HIP manifests itself in the austenite matrix as nonmetallic oxide inclusions. These inclusions facilitate fracture by acting as nucleation sites for the initiation, growth, and coalescence of microvoids in the plastically deforming austenite matrix. Here, we perform analyses based on the Rice-Tracey (RT) void growth model, supported by instrumented Charpy and J-integral fracture toughness testing at ambient temperature, to characterize the degree of void growth ahead of both a V-notch and crack in 304L stainless steel. We show that the hot isostatically pressed (HIP'd) 304L steel exhibits a lower critical void growth at the onset of fracture than that observed in forged 304L steel, which ultimately results in HIP'd steel exhibiting lower fracture toughness at initiation and impact toughness. Although the reduction in toughness of HIP'd steel is not detrimental to its use, due to the steel's sufficiently high toughness, the study does indicate that HIP'd and forged 304L steel behave as subtly different materials at a microstructural level with respect to their fracture behavior.

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“…increase of stress with plastic strain propagation, could be related to a more ordered state of the polymer chains network once subjected to large stretching (Ehrenstein 2001;François et al 2013). Indeed, once untangled, polymer chains tend to offer more resistance against further stretching, and therefore hardening behaviour (Fig.…”

Section: Necking Effect On Sgmentioning

confidence: 99%

The mechanical behaviour of SentryGlas $$^{\circledR }$$ ® ionomer and TSSA silicon bulk materials at different temperatures and strain rates under uniaxial tensile stress state

2016

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An innovative type of connections for glass components, called laminated connections, has been developed in the last years. Two materials have been used for laminated connections: the transparent ionomer SentryGlas (SG) from Kuraray (former Dupont) and the Transparent Structural Silicon Adhesive (TSSA) from Dow Corning. In this paper, the mechanical behaviour of SG and TSSA bulk materials is studied under uniaxial tensile stress condition. The effects of strain rate and temperature variations are investigated. Particular attention is paid (i) to the study of these polymers in cured condition and (ii) to the computation of true stress and strain field during the tests. Firstly, it is observed that the mechanical behaviour of both SG and TSSA are temperature and strain rate dependent. These effects are quantitatively determined in the paper. Secondly, two additional phenomena are observed. For TSSA, it is observed that the material goes from fully transparent to white colour, exhibiting the so-called whitening phenomenon. For SG, instead, it is observed that the strain field distribution is dependent on the temperature. More specifically, the material exhibits a non-uniform strain field distribution due to the occurring of the necking phenomenon. Measurements along the specimens, using Digital Image Correlation techniques, showed that the localized strain propagates over the full specimen length, resulting in a cold-drawing phenomenon. Finally, it is also shown that engineering and true stress-strain definition exhibits large deviation indicating that the finite deformation theory should be used for the computation of the stress-strain curves to be implemented in numerical modelling.

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Damage and Fracture of Non-metallic Materials

Cited by 6 publications

References 92 publications

Laminated connections under tensile load at different temperatures and strain rates

Laminated connections under tensile load at different temperatures and strain rates

An Assessment of the Ductile Fracture Behavior of Hot Isostatically Pressed and Forged 304L Stainless Steel

The mechanical behaviour of SentryGlas $$^{\circledR }$$ ® ionomer and TSSA silicon bulk materials at different temperatures and strain rates under uniaxial tensile stress state

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