Cyclic voltammetry electrodeposition of self-standing Ni–Fe–Sn ternary alloys for accelerating alkaline hydrogen evolution

Lian, Jiqiong; Wu, Yingquan; Lu, Zongtao; Zang, Qianhao

doi:10.1016/j.ijhydene.2023.03.221

Cited by 5 publications

(1 citation statement)

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“…In the meanwhile, at individual potential, it was found that the R 1 for the Ni electrodeposition on Cr/C film electrode was lower than that on W/Si film electrode, which was also in accordance with the smaller value of the real part in impedance spectrum. Furthermore, the R total values for the Ni electrodeposition on Cr/C film at −1 and −1.2 V was roughly half and one-third of that on W/Si film, suggesting a more efficient charge transfer across the electrode/electrolyte interface, which was conducive to lowering the electrochemical reaction resistance [20].…”

Section: Eis and Equivalent Circuit Fittingmentioning

confidence: 96%

Electrochemical study and structural comparison of Ni electrodepositions on W/Si and Cr/C multilayered structure films

Haixiang,

Kun,

Yuntian

et al. 2024

J. Phys. D: Appl. Phys.

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The Ni electrodeposition combined with multilayered structure film is a promising strategy in modern optical manufacturing, while less effort has been devoted to comprehending the electrochemical reaction process, which is essential for their practical applications. In view of this, the initial reduction dynamics and nucleation mechanisms of Ni electrodepositions on multilayer W/Si and Cr/C films were analyzed in this work, and the morphological, crystal, and mechanical characteristics of produced Ni electrodeposits were further determined and compared. The results show that the considerably irregular crystals accompanied by high tensile stress of 119.5 MPa were formed for the Ni electrodeposit on W/Si film, which were mainly attributed to the progressive nucleation process with more severe side reaction of hydrogen evolution. By contrast, the instantaneous nucleation mode with lower reduction resistance were revealed for the Ni electrodeposition on Cr/C film, which presented a comparatively fine–grained texture, less roughness, and smaller stress structure. To summarize, the more stable electrochemical reaction process and improved structure uniformity are obtained for the Ni electrodeposition on metal/C–based film, which offers a theoretical guidance for optimized fabrication of multilayer optical devices in extreme ultraviolet, X–ray, and neutron focusing fields.

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Section: Eis and Equivalent Circuit Fittingmentioning

confidence: 96%