Cyclic creep and fatigue testing of nanocrystalline copper thin films

Hu, Tien-Chen; Wang, Y.-T.; Hsu, Feng-Chih; Sun, P.-K.; Lin, Ming-Tzer

doi:10.1016/j.surfcoat.2012.08.089

Cited by 10 publications

(4 citation statements)

References 24 publications

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“…The ensuing fatigue makes an adverse effect on the copper wires. Research of the fatigue problem has been made on nano-copper films, micro copper wires and large-size copper [15][16][17]19] . Nano-copper is deposited to the desired thickness (300 nm, 500 nm, 700 nm) on a particular shape of the silicon substrate using magnetron sputtering.…”

Section: Introductionmentioning

confidence: 99%

“…Komai [8] applies a small load to the sample with the theory of electromagnetically driving and uses differential transformer to do fatigue test on a micron scale structure. Tsuchiya [10] has made a piezoelectric driven device to do tensile and fatigue tests on micro material which is similar to Hu's [19] . The methods above use expensive machine, inconvenient operation, and have a difference with the actual working conditions.…”

Section: Introductionmentioning

confidence: 99%

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Research on Fatigue Properties of Micron Scale Copper Bonding Wires

Zhao

et al. 2017

KEM

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Copper bonding wires are frequently used to connect to MEMS devices. Mechanical properties of copper wire are crucial to the reliability of MEMS system. The paper reported a symmetrical bending fatigue test on micron scale copper bonding wires. The test is based on the phenomenon that a micro-cantilever can be set into self-excited vibration between two electrodes under DC voltage. The results demonstrate that the yield strength, ultimate tensile strength and Young's modulus of copper wires with diameter of 20μm are higher than those with a diameter of 30μm and 40μm, which significantly performs size effect. In fatigue test, the number of cycles to failure is 104~107. Under the same stress condition, fatigue strength (N=106) of copper wires (d=20μm, 30μm, 40μm) is 140MPa, 97MPa, 70MPa respectively. The tensile fracture surface is the chisel-shaped peak, and the surface of the fracture appears many spaced strip drawing traces. The fatigue fracture surface is flat. Two cracks almost simultaneously originate from the surface, and the final rupture region is just like a narrow sheet.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Research on Fatigue Properties of Micron Scale Copper Bonding Wires

Zhao

et al. 2017

KEM

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“…Although several studies have been conducted on the fatigue in metallic thin films fixed on substrates [25][26][27][28][29][30][31][32] and freestanding films [33][34][35][36], fatigue crack propagation of freestanding submicron-thick films have rarely been studied [37][38][39]. Thin films have a structure with a large surface area to volume ratio, and those formed by physical vapor deposition generally consist of fine columnar grains.…”

Section: Introductionmentioning

confidence: 99%

Fatigue crack closure in submicron-thick freestanding copper films

Kondo

Ishii

Hirakata

et al. 2015

Materials Science and Engineering: A

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“…It also increased the understanding of why the mechanics at the micro-and nanoscale differs from that at the macroscale. Size-effects in the elastic response [6], (temperature dependent) plastic yield strength [7][8][9][10] and cyclic fatigue [11][12][13] of thin films have received considerable attention. Small scale time-dependent mechanics, such as thin film creep, did not attract substantial research efforts yet.…”

Section: Introductionmentioning

confidence: 99%

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

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Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key challenges in creep and anelasticity investigations through on-wafer tensile tests, achieving highly reproducible force and specimen deformation measurements and loading states. The methodology consists of a novel approach for precise loading using a pinin-hole gripper and a high-precision specimen alignment system based on three-dimensional image tracking and optical profilometry resulting in angular alignment of <0.1 mrad and near-perfect co-linearity. A compact test system enables in situ tensile tests of on-wafer specimens under light and electron microscopy. Precision force measurement over a range of 0.07 µN to 250 mN is realized based on a simple drift-compensated elastically-hinged load cell with high-precision deflection measurement. The specimen deformation measurement, compensated for drift through image tracking, yields displacement reproducibility of <6 nm. Proof of principle tensile experiments are performed on 5 µm-thick aluminum-alloy thin film specimens, demonstrating reproducible Young's modulus measurement of 72.6 ± 3.7 GPa. Room temperature creep experiments show excellent stability of the force measurement and underline the methodology's high reproducibility and suitability for time-dependent nanoforce tensile testing of on-wafer specimens.

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Cyclic creep and fatigue testing of nanocrystalline copper thin films

Cited by 10 publications

References 24 publications

Research on Fatigue Properties of Micron Scale Copper Bonding Wires

Research on Fatigue Properties of Micron Scale Copper Bonding Wires

Fatigue crack closure in submicron-thick freestanding copper films

On-wafer time-dependent high reproducibility nano-force tensile testing

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